A3PE3000L-1FG484M vs A3PE3000L-FG484M Comparaison
Comparaison détaillée côte à côte de A3PE3000L-1FG484M par Microchip Technology et A3PE3000L-FG484M par Microchip Technology. Comparez les spécifications clés, les paramètres électriques, le conditionnement, le statut de cycle de vie, les prix et la disponibilité pour déterminer le meilleur composant pour vos exigences de conception.
Microchip Technology
A3PE3000L-1FG484M - 3M-Gate Low-Power Flash FPGA | Microchip
A3PE3000L-1FG484M ✓ ActifMicrochip Technology
A3PE3000L-FG484M - 3M Gate Low-Power Flash FPGA | Microchip
A3PE3000L-FG484M ✓ ActifComparaison des spécifications
| Paramètre | A3PE3000L-1FG484M | A3PE3000L-FG484M |
|---|---|---|
| Marque | Microchip Technology | Microchip Technology |
| Catégorie | FPGA & CPLD | FPGA & CPLD |
| Statut du cycle de vie | Actif | Actif |
| Statut du stock | In Stock | In Stock |
| Prix unitaire (USD) | $0,00 | $129,00 |
| Family | ProASIC3L (Low Power Flash FPGA) | ProASIC3L (Flash-based FPGA) |
| System Gates | 3000000 | 3000000 (3.00E6) |
| Logic Elements | [DATA_NEEDED: exact LE count] | — |
| Number of I/O | 341 | — |
| Maximum Frequency | 250 MHz | — |
| Core Voltage | 1.2 V to 1.5 V | 1.2 V to 1.5 V |
| Technology | 130 nm flash process | — |
| Configuration Memory | On-chip Flash (instant-on, reprogrammable) | Nonvolatile on-chip flash, live at power-up (Level 0) |
| Low Power Feature | Flash*Freeze technology | — |
| Boîtier | 484-ball FBGA (FG484) | — |
| Type de montage | Surface Mount | Surface Mount |
| Speed Grade | -1 (standard) | — |
| Temperature Grade / Operating Temp | M (per ordering code); [DATA_NEEDED: exact operating temperature range] | — |
| JTAG Boundary Scan | IEEE 1149.1 supported | — |
| Input Options | Schmitt trigger option on single-ended inputs (A3PE3000L) | — |
| Pull Options | Weak pull-up / pull-down | — |
| Statut RoHS | [DATA_NEEDED: RoHS status] | — |
| Logic Elements (VersaTiles) | — | 75264 |
| True Dual-Port SRAM | — | 504 kbits |
| User I/O | — | 341 (up to 616 in larger packages) |
| Process Technology | — | 130-nm, 7-layer metal (6 copper) flash-based CMOS |
| Logic Family | — | CMOS |
| Low-Power Feature | — | Flash*Freeze technology |
| Température de fonctionnement | — | 0 to 70 C |
| Tension d'alimentation | — | 1.5 V |
| Package Type | — | FBGA-484, 1 mm pitch, 23 x 23 mm |
| Pins / Balls | — | 484 |
| Single-Chip Solution | — | Yes (no external configuration device required) |