A3PE3000L-1PQG208 vs A3PE3000-PQG208X3 Comparación
Comparación detallada lado a lado de A3PE3000L-1PQG208 por Microchip Technology y A3PE3000-PQG208X3 por Microchip Technology. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Microchip Technology
A3PE3000L-1PQG208 - ProASIC3L FPGA 147 I/O | Microchip
A3PE3000L-1PQG208 ✓ ActivoMicrochip Technology
A3PE3000-PQG208X3 - 3M-Gate Flash FPGA, 231MHz | Microchip
A3PE3000-PQG208X3 ✓ ActivoComparación de especificaciones
| Parámetro | A3PE3000L-1PQG208 | A3PE3000-PQG208X3 |
|---|---|---|
| Marca | Microchip Technology | Microchip Technology |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Activo | Activo |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $162,90 | $128,00 |
| Manufacturer Part Number | A3PE3000L-1PQG208 | — |
| Family | ProASIC3L (ProASIC3E family, low power) | ProASIC3E Flash FPGA |
| System Gates | 3000000 | 3,000,000 (3M) |
| Logic Elements | 35K LEs | — |
| Number of I/O | 147 | — |
| Core Voltage | 1.2 V to 1.5 V | — |
| Tensión de alimentación de funcionamiento | 1.5 V | — |
| Process Technology | 130 nm flash | 130 nm flash |
| Maximum Operating Frequency | 892.86 MHz | — |
| Configuration Memory | Flash (single-chip, reprogrammable) | — |
| Low Power Feature | Flash*Freeze technology (40% dynamic / 50% static power reduction) | — |
| Encapsulado | 208-BFQFP (PQFP-208) | 208-pin BFQFP (PQG208), 0.5 mm pitch |
| Estilo de montaje | SMD/SMT | — |
| Rango de temperatura de funcionamiento | 0C to +70C | — |
| Packaging | Tray | — |
| Lead Free | Yes (G suffix) | — |
| Estado RoHS | [DATA_NEEDED: RoHS compliance status] | [DATA_NEEDED: RoHS status] |
| Maximum System Frequency | — | 231 MHz |
| Core Supply Voltage | — | 1.5 V |
| Number of I/Os (PQG208) | — | 147 |
| Total Memory Bits | — | 516096 |
| Configuration Technology | — | Nonvolatile Flash (Instant-On, single-chip) |
| Tipo de montaje | — | Surface Mount |
| Packing Option | — | Tape and Reel (X3 suffix) |
| Soft ARM Support | — | Optional (per family datasheet) |
| Reprogrammability | — | Yes (in-system reprogrammable) |
| Temperatura de funcionamiento | — | [DATA_NEEDED: operating temperature range] |
| I/O Bank Voltage Support | — | [DATA_NEEDED: supported I/O standards/voltages] |
| Applications Markets | — | Consumer, networking/communications, computing, avionics |