A3PE3000L-FG484I vs A3PE3000L-FG484M Comparación
Comparación detallada lado a lado de A3PE3000L-FG484I por Microchip Technology y A3PE3000L-FG484M por Microchip Technology. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Microchip Technology
A3PE3000L-FG484I - 3M-Gate Flash FPGA, 341 I/O | Microchip
A3PE3000L-FG484I ✓ ActivoMicrochip Technology
A3PE3000L-FG484M - 3M Gate Low-Power Flash FPGA | Microchip
A3PE3000L-FG484M ✓ ActivoComparación de especificaciones
| Parámetro | A3PE3000L-FG484I | A3PE3000L-FG484M |
|---|---|---|
| Marca | Microchip Technology | Microchip Technology |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Activo | Activo |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $0,00 | $129,00 |
| Family | ProASIC3L (ProASIC3 Low Power) | ProASIC3L (Flash-based FPGA) |
| System Gates | 3000000 (3.00E6) | 3000000 (3.00E6) |
| Logic Cells (DFFs) | 75264 | — |
| User I/O (this package) | 341 | — |
| Max User I/O (family) | 616 | — |
| Embedded SRAM | 504 kbit true dual-port | — |
| Process Technology | 130 nm, 7-layer metal (6 copper), flash-based CMOS | 130-nm, 7-layer metal (6 copper) flash-based CMOS |
| Core Supply Voltage | 1.14 V to 1.575 V (1.2 V typical) | — |
| Configuration | Nonvolatile flash, Live-at-Power-Up Level 0 | — |
| Single-Chip Solution | Yes (no external configuration PROM) | Yes (no external configuration device required) |
| Temperatura de funcionamiento | -40C to +100C (TJ, industrial) | 0 to 70 C |
| Encapsulado | 484-ball FBGA (23x23 mm, 1 mm pitch) | — |
| Tipo de montaje | Surface Mount | Surface Mount |
| Speed | [DATA_NEEDED: speed grade / max frequency] | — |
| Estado RoHS | ROHS3 Compliant | — |
| Packaging | Tray | — |
| Manufacturer Lead Time | 8 weeks | — |
| Logic Family | CMOS | CMOS |
| Logic Elements (VersaTiles) | — | 75264 |
| True Dual-Port SRAM | — | 504 kbits |
| User I/O | — | 341 (up to 616 in larger packages) |
| Core Voltage | — | 1.2 V to 1.5 V |
| Configuration Memory | — | Nonvolatile on-chip flash, live at power-up (Level 0) |
| Low-Power Feature | — | Flash*Freeze technology |
| Tensión de alimentación | — | 1.5 V |
| Package Type | — | FBGA-484, 1 mm pitch, 23 x 23 mm |
| Pins / Balls | — | 484 |