A3PE3000L-FG484I vs A3PE3000L-FGG484 Comparación
Comparación detallada lado a lado de A3PE3000L-FG484I por Microchip Technology y A3PE3000L-FGG484 por Microchip Technology. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Microchip Technology
A3PE3000L-FG484I - 3M-Gate Flash FPGA, 341 I/O | Microchip
A3PE3000L-FG484I ✓ ActivoMicrochip Technology
A3PE3000L-FGG484 - ProASIC3L Low Power FPGA 3M Gates | Microchip
A3PE3000L-FGG484 ✓ ActivoComparación de especificaciones
| Parámetro | A3PE3000L-FG484I | A3PE3000L-FGG484 |
|---|---|---|
| Marca | Microchip Technology | Microchip Technology |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Activo | Activo |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $0,00 | $0,00 |
| Family | ProASIC3L (ProASIC3 Low Power) | ProASIC3L (Low Power Flash FPGA) |
| System Gates | 3000000 (3.00E6) | 3,000,000 |
| Logic Cells (DFFs) | 75264 | — |
| User I/O (this package) | 341 | — |
| Max User I/O (family) | 616 | — |
| Embedded SRAM | 504 kbit true dual-port | — |
| Process Technology | 130 nm, 7-layer metal (6 copper), flash-based CMOS | 130 nm flash |
| Core Supply Voltage | 1.14 V to 1.575 V (1.2 V typical) | — |
| Configuration | Nonvolatile flash, Live-at-Power-Up Level 0 | — |
| Single-Chip Solution | Yes (no external configuration PROM) | — |
| Temperatura de funcionamiento | -40C to +100C (TJ, industrial) | [DATA_NEEDED: operating temperature range] |
| Encapsulado | 484-ball FBGA (23x23 mm, 1 mm pitch) | 484-ball FBGA (FGG484), 23 x 23 x 2.44 mm, 1.0 mm pitch |
| Tipo de montaje | Surface Mount | Surface Mount |
| Speed | [DATA_NEEDED: speed grade / max frequency] | — |
| Estado RoHS | ROHS3 Compliant | Compliant (per Newark: RoHS Compliant: Yes) |
| Packaging | Tray | Tray |
| Manufacturer Lead Time | 8 weeks | — |
| Logic Family | CMOS | — |
| Logic Cells | — | 75,264 |
| User I/O | — | 341 |
| Embedded RAM | — | 516,096 bits |
| Core Voltage | — | 1.2 V to 1.5 V |
| Configuration Technology | — | Nonvolatile flash, Instant On |
| Low Power Feature | — | Flash*Freeze technology |
| Supply Voltage - I/O | — | [DATA_NEEDED: I/O bank voltage range] |
| Security | — | Single-chip, flash-based, secure nonvolatile configuration |