A3PE3000L-FG484I vs A3PE3000L-FGG484 对比

详细并排对比 A3PE3000L-FG484I 出自 Microchip Technology 和 A3PE3000L-FGG484 出自 Microchip Technology。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况,以确定最适合您设计需求的元器件。

Microchip Technology
A3PE3000L-FG484I A3PE3000L-FG484I - 3M-Gate Flash FPGA, 341 I/O | Microchip

A3PE3000L-FG484I - 3M-Gate Flash FPGA, 341 I/O | Microchip

A3PE3000L-FG484I ✓ 量产中
Microchip Technology
A3PE3000L-FGG484 A3PE3000L-FGG484 - ProASIC3L Low Power FPGA 3M Gates | Microchip

A3PE3000L-FGG484 - ProASIC3L Low Power FPGA 3M Gates | Microchip

A3PE3000L-FGG484 ✓ 量产中

规格对比

参数 A3PE3000L-FG484I A3PE3000L-FGG484
品牌 Microchip Technology Microchip Technology
分类 FPGA & CPLD FPGA & CPLD
生命周期状态 有效 有效
库存状态 有库存 有库存
单价(USD) $0.00 $0.00
Family ProASIC3L (ProASIC3 Low Power) ProASIC3L (Low Power Flash FPGA)
System Gates 3000000 (3.00E6) 3,000,000
Logic Cells (DFFs) 75264 —
User I/O (this package) 341 —
Max User I/O (family) 616 —
Embedded SRAM 504 kbit true dual-port —
Process Technology 130 nm, 7-layer metal (6 copper), flash-based CMOS 130 nm flash
Core Supply Voltage 1.14 V to 1.575 V (1.2 V typical) —
Configuration Nonvolatile flash, Live-at-Power-Up Level 0 —
Single-Chip Solution Yes (no external configuration PROM) —
工作温度 -40C to +100C (TJ, industrial) [DATA_NEEDED: operating temperature range]
封装 484-ball FBGA (23x23 mm, 1 mm pitch) 484-ball FBGA (FGG484), 23 x 23 x 2.44 mm, 1.0 mm pitch
安装类型 Surface Mount Surface Mount
Speed [DATA_NEEDED: speed grade / max frequency] —
RoHS 状态 ROHS3 Compliant Compliant (per Newark: RoHS Compliant: Yes)
Packaging Tray Tray
Manufacturer Lead Time 8 weeks —
Logic Family CMOS —
Logic Cells — 75,264
User I/O — 341
Embedded RAM — 516,096 bits
Core Voltage — 1.2 V to 1.5 V
Configuration Technology — Nonvolatile flash, Instant On
Low Power Feature — Flash*Freeze technology
Supply Voltage - I/O — [DATA_NEEDED: I/O bank voltage range]
Security — Single-chip, flash-based, secure nonvolatile configuration

数据手册与资源

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