A3PE3000L-FGG896 vs A3PE3000-FGG896I Comparación

Comparación detallada lado a lado de A3PE3000L-FGG896 por Microchip Technology y A3PE3000-FGG896I por Microchip Technology. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.

Microchip Technology
A3PE3000L-FGG896 A3PE3000L-FGG896 - 3M Gate Flash FPGA | Microchip Technology

A3PE3000L-FGG896 - 3M Gate Flash FPGA | Microchip Technology

A3PE3000L-FGG896 ✓ Activo
Microchip Technology
A3PE3000-FGG896I A3PE3000-FGG896I - ProASIC3E FPGA 620 I/O | Microchip

A3PE3000-FGG896I - ProASIC3E FPGA 620 I/O | Microchip

A3PE3000-FGG896I ✓ Activo

Comparación de especificaciones

Parámetro A3PE3000L-FGG896 A3PE3000-FGG896I
Marca Microchip Technology Microchip Technology
Categoría FPGA & CPLD FPGA & CPLD
Estado del ciclo de vida Activo Activo
Estado del stock In Stock In Stock
Precio unitario (USD) $55,00 $135,20
System Gates 3,000,000 —
Logic Cells 75,264 —
Total SRAM 504 kbits —
User I/Os (FGG896) 620 —
Encapsulado 896-ball FBGA (FGG896), 1.0 mm pitch —
Tipo de montaje Surface Mount —
Core Supply Voltage 1.2 V to 1.5 V —
I/O Supply Voltage [DATA_NEEDED: I/O supply voltage range] —
Temperatura de funcionamiento 0 C to +70 C —
Logic Family CMOS —
Process Technology 130-nm, 7-layer metal (6 copper), flash-based 130 nm flash
Flash*Freeze Support Yes —
Live-At-Power-Up Level 0 support —
Reconfiguration Reprogrammable (in-system programmable) —
Lead-Free Finish Yes —
Estado RoHS [DATA_NEEDED: RoHS compliance status] [DATA_NEEDED: RoHS Status]
Clock Inputs [DATA_NEEDED: number of clock conditioning circuits/PLLs] —
Speed Grade [DATA_NEEDED: speed grade for -FGG896 base part] —
Power Consumption [DATA_NEEDED: typical static/dynamic power] —
Ball Count 896 —
Family — ProASIC3E
Logic Elements (LEs) — 35,000 LEs
Number of I/Os — 620 I/O
Operating Supply Voltage (Core) — 1.5 V
System Performance — 231 MHz
Encapsulado / Carcasa — 896-BGA (FBGA, FGG896)
Estilo de montaje — SMD/SMT
Minimum Operating Temperature — -40 C
Maximum Operating Temperature — +85 C
Temperature Grade — Industrial (I)
Packaging — Tray
Configuration Memory — On-chip Flash (nonvolatile, Instant-On)
Terminal Form — Ball
Terminal Count — 896
Product Series — A3PE3000
Total On-Chip Configuration Bits — 516096 (per DigiKey listing)

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