A3PE3000-FGG896I - ProASIC3E FPGA 620 I/O | Microchip
N.º de pieza: A3PE3000-FGG896I ✓ Activo| Cant. | Precio unitario | Total |
|---|---|---|
| 1 | $185 | $185,00 |
| 10 | $171.5 | $1.715,00 |
| 100 | $158.4 | $15.840,00 |
| 500 | $146.3 | $73.150,00 |
| 1.000 | $135.2 | $135.200,00 |
A3PE3000-FGG896I Descripción general
A Flash FPGA is a field-programmable gate array that stores its configuration in on-chip nonvolatile flash memory rather than an external configuration ROM. In the programmable logic hierarchy, the A3PE3000 sits within the ProASIC3E family, which itself belongs to the broader categories of nonvolatile FPGAs, programmable logic devices, and digital semiconductors. Because the configuration is retained on-chip, the device is a true single-chip, Instant-On solution that needs no boot PROM and offers inherent resistance to configuration readback.
Key features include reprogrammable flash fabric based on the third-generation VersaTile architecture, where each tile functions as a three-input LUT or a D-flip-flop/latch with enable; a large 620-pin I/O budget supporting high-pin-count board interfaces; low total cost of ownership through single-chip integration; and industrial-grade temperature qualification for harsh environments.
The ProASIC3E fabric provides distributed block routing and embedded memory within the family architecture, supporting glue logic consolidation, bus bridging, control-plane functions, and custom data-path implementations. The VersaTile structure allows efficient synthesis mapping, and Microchip's Libero SoC design suite supports HDL entry, synthesis, simulation, and programming of the device.
Typical applications include industrial automation controllers, communications and networking line cards, test and measurement instrumentation, medical equipment, and aerospace/defense subsystems where nonvolatile, secure, single-chip FPGA integration is required.
A key design consideration is power distribution: the 1.5 V core rail must be well regulated and decoupled across the 896-ball package, and high-speed I/O banks require careful banking and reference planning in the pinout assignment.
This page synthesizes verified distributor data, drop-in same-family alternatives, and practical design notes not found in the manufacturer datasheet.
Alternativas directas para A3PE3000-FGG896I — mismo encapsulado, compatible pin a pin. Se excluyen las piezas de otro encapsulado que requieren retrabajo de la PCB.
Variantes de esta serie
Modelos de la misma serie compatibles directamente con A3PE3000-FGG896I (mismo factor de forma y huella) — difiere en Package, Configuration Memory, Family, Process Technology, Operating Temperature.
Herramienta de comparación rápida — seleccione piezas alternativas para compararlas lado a lado:
A3PE3000-2FGG896I
✅ Sustitución directa✓ En stock
$1482.9 / unidad
Ver hoja de datos →A3PE3000L-FGG896
✅ Sustitución directa✓ En stock
$55 / unidad
Ver hoja de datos →A3PE3000L-1FGG896I
✅ Sustitución directa✓ En stock
Consulte el precio
Ver hoja de datos →A3PE3000L-FGG896M
✅ Sustitución directa✓ En stock
Consulte el precio
Ver hoja de datos →A3PE3000-FGG896I Valores máximos y características eléctricas
| Family | ProASIC3E |
| Logic Elements (LEs) | 35,000 LEs |
| Number of I/Os | 620 I/O |
| Operating Supply Voltage (Core) | 1.5 V |
| System Performance | 231 MHz |
| Process Technology | 130 nm flash |
| Encapsulado / Carcasa | 896-BGA (FBGA, FGG896) |
| Estilo de montaje | SMD/SMT |
| Minimum Operating Temperature | -40 C |
| Maximum Operating Temperature | +85 C |
| Temperature Grade | Industrial (I) |
| Packaging | Tray |
| Configuration Memory | On-chip Flash (nonvolatile, Instant-On) |
| Terminal Form | Ball |
| Terminal Count | 896 |
| Product Series | A3PE3000 |
| Total On-Chip Configuration Bits | 516096 (per DigiKey listing) |
Guía de configuración de pines de A3PE3000-FGG896I 896-bga (fbga, fgg896)
Configuración de pines para A3PE3000-FGG896I (encapsulado 896-bga (fbga, fgg896)). Este CI digital incluye GPIO, interfaces de comunicación (UART, SPI, I2C) y pines de alimentación. Consulte la hoja de datos del fabricante para conocer las funciones alternativas de los pines y las opciones de configuración. Esencial para el diseño de sistemas embebidos y el diseño de PCB.
No hay datos detallados de patillaje disponibles para A3PE3000-FGG896I.
Consulte la hoja de datos para ver la configuración completa de patillas.
Aplicaciones típicas
A3PE3000-FGG896I es adecuado para 6 aplicacións: Industrial Automation and Control, Communications and Networking Line Cards, Test and Measurement Instrumentation, Medical Equipment, Aerospace and Defense Subsystems, Embedded Bridge and Glue Logic Consolidation.
Industrial Automation and Control
The A3PE3000-FGG896I fits industrial controllers because its -40C to +85C industrial rating and nonvolatile flash configuration guarantee Instant-On behavior at power-up, a hard requirement for factory equipment that must initialize without a boot sequence. With 35,000 LEs and 620 user I/Os, one device consolidates PLC I/O interfaces, fieldbus protocol bridges, and safety interlock sequencing that would otherwise need several CPLDs and glue chips, cutting board area and BOM lines. In use, the fabric implements I/O expansion, address decoding, and deterministic control state machines at up to 231 MHz system performance on a 1.5 V core. The trade-off versus a microcontroller solution is higher static power but far greater parallel I/O flexibility.
Recomendado
Communications and Networking Line Cards
Line cards need high pin counts for backplane interfaces, which is exactly where the 620-user-I/O budget of the FGG896 package pays off. The A3PE3000-FGG896I handles backplane bridging, framing, and control-plane multiplexing in its 35,000-LE fabric, while the on-chip flash configuration removes the external boot PROM that would otherwise add a reliability point in always-on telecom equipment. Per the ProASIC3E datasheet, VersaTiles map efficiently to bus-oriented logic, supporting 231 MHz-class system performance on the 130 nm flash process. Designers should budget the 1.5 V core rail carefully across the 896-ball package and plan I/O banking against backplane voltage standards before final pin lock.
Recomendado
Test and Measurement Instrumentation
Bench and automated test instruments benefit from the A3PE3000-FGG896I's combination of reprogrammability and Instant-On flash configuration: instruments power up ready to measure with no configuration latency, and designs can be field-updated over JTAG or the flash programming interface. The 35,000 LEs implement trigger logic, timing generators, channel acquisition sequencing, and bus interfaces, while the 620 I/Os connect dense front-end channel arrays. At 231 MHz system performance on a 1.5 V core, the device sustains deterministic timing cores without external configuration devices. The trade-off versus SRBA/SRAM FPGAs is lower fabric speed, so keep sub-ns timing loops in dedicated front-end ASICs and use this FPGA for system logic.
Recomendado
Medical Equipment
Diagnostic and monitoring equipment requires deterministic startup and long product lifecycles, both strengths of the A3PE3000-FGG896I. Its nonvolatile flash fabric makes the FPGA live at power application - important for patient-facing devices with startup-time expectations - and eliminates configuration readout, supporting design-integrity requirements. The 35,000 LEs and 620 I/Os integrate sensor front-end sequencing, display interfaces, and communication bridges for patient data buses in one package operating reliably across the commercial-room to industrial temperature envelope. Designers should validate I/O standards (LVCMOS levels on 1.5 V core, banked VCCI rails) against attached sensor and isolation circuitry, and apply conservative derating to timing closures for patient-safety margins.
Recomendado
Aerospace and Defense Subsystems
Flash-based ProASIC3E devices are widely deployed in aerospace and defense because the configuration is stored on-chip in nonvolatile flash, reducing configuration-readout exposure compared to SRAM FPGAs, and because Microchip/Microsemi FPGA families carry long lifecycle commitments. The A3PE3000-FGG896I's industrial -40C to +85C rating supports benign avionics environments, while 35,000 LEs and 620 I/Os implement bus protocol handling, telemetry formatting, and sensor aggregation. Instant-On operation matters in systems with strict time-to-first-fix requirements. Note this standard-grade part is not automotive/defense-qualified by suffix; for military-grade flows, evaluate the military temperature variants of the family instead of this industrial I-suffix device.
Recomendado
Embedded Bridge and Glue Logic Consolidation
A classic ProASIC3E use case is consolidating scattered glue logic - bus translation, wait-state generation, address decoding, legacy-interface emulation - into one reprogrammable chip. The A3PE3000-FGG896I's 35,000 LEs absorb dozens of 7400-family functions, and its 620 I/Os provide the width needed for 32/64-bit legacy buses that modern SoCs no longer support. Because configuration is flash-resident, the consolidated logic is functional immediately at power-on with no host involvement, per Microchip's ProASIC3E datasheet. Designing at 231 MHz-class system performance on a 1.5 V core, engineers should dedicate Libero SoC timing constraints per interface domain and verify I/O bank voltage compatibility (VCCI per bank) before pin lock to avoid respins.
Recomendado
Resumen de productos recomendados
Datos de referencia de ingeniería para A3PE3000-FGG896I — comparación, orientación de diseño e información de cumplimiento.
Guía de selección
Comparación con alternativas
| Parámetro | Este producto | A3PE3000-2FGG896I | A3PE3000L-FGG896 | A3PE3000L-1FGG896I | A3PE3000L-FGG896M |
|---|---|---|---|---|---|
| Package | 896-BGA (FGG896) | 896-BGA (FGG896) - same | 896-BGA (FGG896) - same | 896-BGA (FGG896) - same | 896-BGA (FGG896) - same |
| Brand | Microchip Technology (Microsemi) | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Logic Elements | 35,000 LEs | 35,000 LEs | 35,000 LEs | 35,000 LEs | 35,000 LEs |
| User I/Os | 620 | 620 | 620 | 620 | 620 |
| Core Supply Voltage | 1.5 V | 1.5 V | 1.5 V (with Flash*Freeze low-power mode) | 1.5 V (with Flash*Freeze low-power mode) | 1.5 V |
| Speed Grade / Performance | Standard grade, up to 231 MHz | -2 faster speed grade | Lower dynamic performance (ProASIC3L) | -1 speed grade, ProASIC3L | ProASIC3L grade coding |
| Low-Power Flash*Freeze Technology | No | No | Yes | Yes | Yes (ProASIC3L family) |
Diferenciadores clave
- Cost-optimized standard speed grade (frente a A3PE3000-2FGG896I)
- Higher performance than low-power family members (frente a A3PE3000L-FGG896)
- Industrial temperature guarantee (frente a A3PE3000L-FGG896M)
Notas de diseño
The A3PE3000-FGG896I runs its core at 1.5 V, with separate VCCI rails per I/O bank selectable to match interfaced logic families. With 620 active I/Os, dynamic core and I/O current can reach amperes during high toggle-rate operation, so size the core VRM for peak rather than average estimates and use Microchip's Libero SoC power calculator with post-layout activity data. Decouple the 1.5 V rail with a network of bulk plus 0.1 uF/0.01 uF ceramics distributed across the 896-ball array; all VCC/VCCI/GND balls in the FGG896 footprint must be connected, not only those near your signals.
An 896-ball FBGA with fine pitch requires careful substrate stack-up: plan at least one buried via layer pair for ball fanout, and use via-in-pad with filled caps only if your fabricator supports it. Route the JTAG programming chain (TDI/TMS/TCK/TDO) as a daisy chain with series termination near the driver, since it is also your production programming and debug path. Reference-plane integrity under the ball array matters for the high-speed I/O banks - avoid splitting planes beneath banked signal groups, and follow the ProASIC3E datasheet package mechanical drawing for land-pattern dimensions (per IPC-style BGA land pattern practice as published by Microchip).
Three recurring mistakes with this family: (1) Ignoring I/O banking rules - VCCI is per bank, so assigning signals of different voltage standards to one bank in Libero SoC forces respins; lock banks early. (2) Assuming pin compatibility with other FPGA vendors - Xilinx/Intel parts in similar packages have different ball maps; only same-family Microchip variants are drop-in. (3) Treating speed grades casually - designs that meet timing on the -2 grade may fail on this standard grade; run static timing analysis in Libero SoC at worst-case industrial corners (-40C and +85C) before committing to the standard suffix.
Información de cumplimiento
RoHS/REACH status was not stated in the retrieved distributor snippets for this MPN; confirm on the Microchip product page environmental data sheet before export-controlled or EU-market builds.
