A3PE3000L-FGG896I vs A3PE3000-FG896I Comparación
Comparación detallada lado a lado de A3PE3000L-FGG896I por Microchip Technology y A3PE3000-FG896I por Microchip Technology. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Microchip Technology
A3PE3000L-FGG896I - 3M Gate Low Power Flash FPGA | Microchip
A3PE3000L-FGG896I ✓ ActivoMicrochip Technology
A3PE3000-FG896I - ProASIC3E FPGA, 3M Gates, 896-BGA | Microchip
A3PE3000-FG896I ✓ ActivoComparación de especificaciones
| Parámetro | A3PE3000L-FGG896I | A3PE3000-FG896I |
|---|---|---|
| Marca | Microchip Technology | Microchip Technology |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Activo | Activo |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $139,90 | $195,00 |
| Family | ProASIC3L | ProASIC3E Flash Family FPGAs |
| System Gates | 3000000 | 3M gates |
| Total RAM Bits | 516096 bits | — |
| Embedded Memory Type | True Dual-Port SRAM (504 kbits) | — |
| Number of I/O | 620 | — |
| Tensión de alimentación | 1.14 V to 1.575 V | — |
| Core Voltage Support | 1.2 V to 1.5 V | — |
| Logic Family / Process | CMOS, 130-nm, 7-layer metal (6 copper), flash-based | — |
| Configuration Technology | Nonvolatile Flash, Live-at-Power-Up Level 0 | — |
| Special Features | Flash*Freeze technology, single-chip solution | — |
| Encapsulado / Carcasa | 896-BGA (FBGA, 1 mm pitch) | — |
| Tipo de montaje | Surface Mount (SMD/SMT) | Surface Mount |
| Temperatura de funcionamiento | Industrial grade (I suffix) | — |
| Packaging | Tray, standard quantity 27 | Tray |
| Estado RoHS | [DATA_NEEDED: RoHS status] | RoHS Compliant: Yes |
| Speed Grade | Standard (no speed suffix) | — |
| Logic Elements | — | 35KLEs |
| User I/Os | — | 620 |
| Maximum System Frequency | — | 231 MHz |
| Core Supply Voltage | — | 1.5 V |
| Process Technology | — | 130 nm flash |
| Configuration Memory | — | Nonvolatile Flash (single-chip, Instant On) |
| Encapsulado | — | 896-Pin FBGA (896-BGA) |
| Package Dimensions | — | 31 x 31 x 2.44 mm |
| Terminal Form | — | Ball |
| Rango de temperatura de funcionamiento | — | Industrial (-40C to +85C) |
| Temperature Grade | — | I (Industrial) |
| Programming Support | — | Reprogrammable, Cortex-M1 soft processor support |