A3PE3000L-FGG896I vs A3PE3000L-1FGG896 Comparación
Comparación detallada lado a lado de A3PE3000L-FGG896I por Microchip Technology y A3PE3000L-1FGG896 por Microchip Technology. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Microchip Technology
A3PE3000L-FGG896I - 3M Gate Low Power Flash FPGA | Microchip
A3PE3000L-FGG896I ✓ ActivoMicrochip Technology
A3PE3000L-1FGG896 - 3M-Gate ProASIC3L Flash FPGA | Microchip
A3PE3000L-1FGG896 ✓ ActivoComparación de especificaciones
| Parámetro | A3PE3000L-FGG896I | A3PE3000L-1FGG896 |
|---|---|---|
| Marca | Microchip Technology | Microchip Technology |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Activo | Activo |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $139,90 | $255,00 |
| Family | ProASIC3L | ProASIC3L |
| System Gates | 3000000 | 3000000 |
| Total RAM Bits | 516096 bits | — |
| Embedded Memory Type | True Dual-Port SRAM (504 kbits) | — |
| Number of I/O | 620 | — |
| Tensión de alimentación | 1.14 V to 1.575 V | — |
| Core Voltage Support | 1.2 V to 1.5 V | — |
| Logic Family / Process | CMOS, 130-nm, 7-layer metal (6 copper), flash-based | — |
| Configuration Technology | Nonvolatile Flash, Live-at-Power-Up Level 0 | — |
| Special Features | Flash*Freeze technology, single-chip solution | Flash*Freeze technology |
| Encapsulado / Carcasa | 896-BGA (FBGA, 1 mm pitch) | — |
| Tipo de montaje | Surface Mount (SMD/SMT) | Surface Mount |
| Temperatura de funcionamiento | Industrial grade (I suffix) | — |
| Packaging | Tray, standard quantity 27 | Tray |
| Estado RoHS | [DATA_NEEDED: RoHS status] | — |
| Speed Grade | Standard (no speed suffix) | -1 |
| Logic Cells | — | 75264 |
| User I/O | — | 620 |
| Total Bits of RAM | — | [DATA_NEEDED: Total embedded RAM bits] |
| Core Voltage | — | 1.2 V (supports 1.2 V to 1.5 V) |
| I/O Voltage | — | As low as 1.2 V |
| Process Technology | — | 130 nm flash |
| Configuration Memory | — | Nonvolatile flash (single-chip) |
| Encapsulado | — | 896-ball FBGA (FGG896), 1.00 mm pitch |
| Terminal Pitch | — | 1.00 mm |
| Technology Base | — | CMOS flash |
| Dynamic Power Reduction vs ProASIC3 | — | Approx. 40% |
| Static Power Reduction vs ProASIC3 | — | Approx. 50% |