A3PE600-1FGG256I vs A3PE600-FGG256I Comparación
Comparación detallada lado a lado de A3PE600-1FGG256I por Microchip Technology y A3PE600-FGG256I por Microchip Technology. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Microchip Technology
A3PE600-1FGG256I - 600K-Gate Flash FPGA 165 I/O | Microchip
A3PE600-1FGG256I ✓ ActivoMicrochip Technology
A3PE600-FGG256I - ProASIC3E 600K-Gate Flash FPGA | Microchip
A3PE600-FGG256I ✓ ActivoComparación de especificaciones
| Parámetro | A3PE600-1FGG256I | A3PE600-FGG256I |
|---|---|---|
| Marca | Microchip Technology | Microchip Technology |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Activo | Activo |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $33,50 | $41,80 |
| System Gates | 600000 | 600000 gates |
| Logic Cells | 13824 | — |
| Embedded SRAM | 110592 bits (up to 504 kbits family density) | — |
| User I/O | 165 | 165 |
| Maximum System Performance | 272 MHz | — |
| Core Supply Voltage | 1.425 V to 1.575 V (1.5 V nominal) | 1.5 V |
| Process Technology | 130-nm, 7-layer metal (6 copper), flash-based CMOS | CMOS flash FPGA |
| Configuration Memory | On-chip Flash (Live at Power-Up, Level 0) | On-chip Flash (non-volatile, single-chip) |
| Encapsulado | 256-LBGA (FBGA-256), 1.0 mm ball pitch | 256-FBGA (S-PBGA-B256), 17 x 17 mm |
| Temperatura de funcionamiento | -40C to +100C (TJ), industrial | -40C to +85C (Industrial) |
| Tipo de montaje | Surface Mount | Surface Mount |
| Logic Family | CMOS | — |
| Speed Grade | -1 | — |
| Family | ProASIC3E | ProASIC3E Flash FPGA |
| Reprogrammability | Yes (single-chip, no external boot PROM) | — |
| Typical Application Domains | Industrial, communications, medical, aerospace/defense | — |
| Estado RoHS | [DATA_NEEDED: RoHS compliance status] | Compliant (lead free) |
| Logic Elements (VersaTiles) | — | 13824 |
| Embedded Flash Memory | — | 110592 bits |
| Maximum Internal Performance | — | 350 MHz |
| Ball Pitch | — | 1.0 mm |
| Package Height | — | 1.6 mm |
| Footprint Compatibility | — | FG256 and FG484 footprint-compatible packages |