A3PE600-2FGG256 vs M1AFS1500-2FGG256 Comparación
Comparación detallada lado a lado de A3PE600-2FGG256 por Microchip Technology y M1AFS1500-2FGG256 por Microchip Technology. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Microchip Technology
A3PE600-2FGG256 - ProASIC3E Flash FPGA 600K Gates | Microchip
A3PE600-2FGG256 ✓ ActivoMicrochip Technology
M1AFS1500-2FGG256 - 1.5M Gate Fusion FPGA with Cortex-M1 | Microchip
M1AFS1500-2FGG256 ✓ ActivoComparación de especificaciones
| Parámetro | A3PE600-2FGG256 | M1AFS1500-2FGG256 |
|---|---|---|
| Marca | Microchip Technology | Microchip Technology |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Activo | Activo |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $33,15 | $124,50 |
| Family | ProASIC3E Flash FPGA | — |
| System Gates | 600000 | 1,500,000 |
| Logic Elements (CLBs) | 13824 | — |
| Maximum System Frequency | 310 MHz | — |
| Process Technology | 130 nm CMOS | — |
| Core Voltage | 1.5 V | — |
| Number of User I/O | 165 | — |
| Configuration Memory | On-chip Flash (non-volatile, single-chip) | — |
| Speed Grade | -2 | -2 |
| Encapsulado | 256-LBGA (FGG256) | — |
| Tipo de montaje | Surface Mount | — |
| Reprogrammability | In-system reprogrammable | — |
| Temperatura de funcionamiento | [DATA_NEEDED: operating temperature range] | — |
| Embedded SRAM | [DATA_NEEDED: total embedded SRAM capacity] | — |
| I/O Standards | [DATA_NEEDED: supported I/O standards list] | — |
| Estado RoHS | Compliant | — |
| Supply Voltage Class | 1.5 V core / 3.3 V I/O class | — |
| Series | — | M1AFS1500 (Fusion) |
| Logic Cells | — | 38,400 |
| Embedded Processor | — | ARM Cortex-M1 |
| Frecuencia de reloj máxima | — | 350 MHz |
| Number of I/O | — | 119 |
| Tensión de alimentación de funcionamiento | — | 1.5 V |
| Flash Memory Bits (reported) | — | 276480 |
| Technology | — | CMOS, 130nm class |
| Encapsulado / Carcasa | — | 256-LBGA (FBGA, S-PBGA-B256) |
| Ball Pitch | — | 1.00 mm |
| Estilo de montaje | — | SMD/SMT |
| Rango de temperatura de funcionamiento | — | 0C to +70C |
| Analog Blocks | — | Configurable analog (Fusion mixed-signal architecture) |
| Programming Type | — | Flash-based (in-system programmable) |
| Packaging | — | Tray |
| Moisture Sensitivity Level | — | [DATA_NEEDED: MSL level] |
| Total RAM Blocks | — | [DATA_NEEDED: RAM block count] |