A3PE600-FG484 vs A3PE600-1FGG484 Comparación
Comparación detallada lado a lado de A3PE600-FG484 por Microchip Technology y A3PE600-1FGG484 por Microchip Technology. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Microchip Technology
A3PE600-FG484 - ProASIC3E 600K-Gate Flash FPGA | Microchip
A3PE600-FG484 ✓ ActivoMicrochip Technology
A3PE600-1FGG484 - 600K Gate Flash FPGA 484-FBGA | Microchip
A3PE600-1FGG484 ✓ ActivoComparación de especificaciones
| Parámetro | A3PE600-FG484 | A3PE600-1FGG484 |
|---|---|---|
| Marca | Microchip Technology | Microchip Technology |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Activo | Activo |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $59,00 | $44,90 |
| Family | ProASIC3E (Flash FPGA) | ProASIC3E |
| System Gates | 600000 | 600000 |
| Logic Cells (CLBs) | 13824 | — |
| User I/Os | 270 | — |
| Embedded Memory | 110592 | — |
| Maximum System Frequency | 231 MHz | — |
| Core Voltage | 1.5 V | — |
| Technology | 130 nm CMOS flash | — |
| Encapsulado | 484-ball FBGA (23 x 23 mm, 1.0 mm pitch) | 484-FPBGA (FBGA-484), 23 x 23 mm, 1 mm pitch |
| Package Height | 2.23 mm | — |
| Tipo de montaje | Surface Mount | Surface Mount |
| Configuration | Nonvolatile flash (single-chip, no external configuration PROM) | — |
| Package Footprint Compatibility | FG256 and FG484 footprint-compatible | — |
| Soft Processor Support | Soft ARM support | — |
| Estado RoHS | [DATA_NEEDED: RoHS status] | ROHS3 Compliant |
| Temperatura de funcionamiento | [DATA_NEEDED: operating temperature range] | 0 C to +85 C (TJ) |
| Packaging | Tray | Tray |
| Logic Cells / CLBs | — | 13824 |
| User I/Os (this package) | — | 270 |
| Max User I/Os (family) | — | 616 |
| Embedded SRAM | — | 110592 bits (504 kbits true dual-port max per family data) |
| Core Supply Voltage | — | 1.425 V to 1.575 V (1.5 V nominal) |
| Process Technology | — | 130 nm, 7-layer metal (6 copper), flash-based CMOS |
| Configuration Memory | — | On-chip flash, live at power-up (Level 0) |
| Speed Grade | — | -1 |
| Product Status | — | Active |
| Manufacturer Lead Time | — | 8 weeks |
| Reprogrammability | — | Yes, single-chip solution, no external boot device |