A3PE600-FG484 vs A3PE600-1FGG484 Comparaison
Comparaison détaillée côte à côte de A3PE600-FG484 par Microchip Technology et A3PE600-1FGG484 par Microchip Technology. Comparez les spécifications clés, les paramètres électriques, le conditionnement, le statut de cycle de vie, les prix et la disponibilité pour déterminer le meilleur composant pour vos exigences de conception.
Microchip Technology
A3PE600-FG484 - ProASIC3E 600K-Gate Flash FPGA | Microchip
A3PE600-FG484 ✓ ActifMicrochip Technology
A3PE600-1FGG484 - 600K Gate Flash FPGA 484-FBGA | Microchip
A3PE600-1FGG484 ✓ ActifComparaison des spécifications
| Paramètre | A3PE600-FG484 | A3PE600-1FGG484 |
|---|---|---|
| Marque | Microchip Technology | Microchip Technology |
| Catégorie | FPGA & CPLD | FPGA & CPLD |
| Statut du cycle de vie | Actif | Actif |
| Statut du stock | In Stock | In Stock |
| Prix unitaire (USD) | $59,00 | $44,90 |
| Family | ProASIC3E (Flash FPGA) | ProASIC3E |
| System Gates | 600000 | 600000 |
| Logic Cells (CLBs) | 13824 | — |
| User I/Os | 270 | — |
| Embedded Memory | 110592 | — |
| Maximum System Frequency | 231 MHz | — |
| Core Voltage | 1.5 V | — |
| Technology | 130 nm CMOS flash | — |
| Boîtier | 484-ball FBGA (23 x 23 mm, 1.0 mm pitch) | 484-FPBGA (FBGA-484), 23 x 23 mm, 1 mm pitch |
| Package Height | 2.23 mm | — |
| Type de montage | Surface Mount | Surface Mount |
| Configuration | Nonvolatile flash (single-chip, no external configuration PROM) | — |
| Package Footprint Compatibility | FG256 and FG484 footprint-compatible | — |
| Soft Processor Support | Soft ARM support | — |
| Statut RoHS | [DATA_NEEDED: RoHS status] | ROHS3 Compliant |
| Température de fonctionnement | [DATA_NEEDED: operating temperature range] | 0 C to +85 C (TJ) |
| Packaging | Tray | Tray |
| Logic Cells / CLBs | — | 13824 |
| User I/Os (this package) | — | 270 |
| Max User I/Os (family) | — | 616 |
| Embedded SRAM | — | 110592 bits (504 kbits true dual-port max per family data) |
| Core Supply Voltage | — | 1.425 V to 1.575 V (1.5 V nominal) |
| Process Technology | — | 130 nm, 7-layer metal (6 copper), flash-based CMOS |
| Configuration Memory | — | On-chip flash, live at power-up (Level 0) |
| Speed Grade | — | -1 |
| Product Status | — | Active |
| Manufacturer Lead Time | — | 8 weeks |
| Reprogrammability | — | Yes, single-chip solution, no external boot device |