AD7686BCPZ-R2 vs AD7686BCPZ Comparación
Comparación detallada lado a lado de AD7686BCPZ-R2 por Analog Devices y AD7686BCPZ por Analog Devices. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | AD7686BCPZ-R2 | AD7686BCPZ |
|---|---|---|
| Marca | Analog Devices | Analog Devices |
| Categoría | ADC/DAC | ADC/DAC |
| Estado del ciclo de vida | Activo | Activo |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $6,80 | $11,90 |
| Resolución | 16 bit | 16 bits |
| Number of Sample Points | [DATA_NEEDED: number_of_inputs] | — |
| Frecuencia de muestreo | 500 kSPS | 500 kSPS |
| Architecture | SAR (Successive Approximation) | — |
| Input Type | Single-Ended, Pseudo-Differential | Pseudo-differential |
| Number of Channels | 1 | 1 |
| Supply Voltage VDD | 4.5 V to 5.5 V | — |
| Logic Interface Voltage VIO | 2.3 V to 5.5 V | — |
| Tensión de referencia | 2.5 V internal (typical) or external | — |
| Power Consumption | [DATA_NEEDED: power_consumption_active_value] | — |
| Power Consumption (Full Power Down) | [DATA_NEEDED: power_down_value] | — |
| Rango de temperatura de funcionamiento | -40 °C to +85 °C | — |
| Encapsulado | 10-LFCSP-WD (3x3 mm) with exposed pad | 10-LFCSP-WD (3x3 mm) |
| Tipo de montaje | Surface Mount | Surface Mount |
| Interfaz | SPI, QSPI, MICROWIRE, DSP-compatible serial | SPI |
| INL (Max) | [DATA_NEEDED: inl_max] | — |
| SNR (typical) | [DATA_NEEDED: snr_typical] | — |
| ESD Rating (HBM) | [DATA_NEEDED: esd_hbm] | — |
| Estado RoHS | Compliant | Compliant |
| Nivel MSL | [DATA_NEEDED: msl_level] | — |
| Tensión de alimentación | — | 2.3V to 5.5V |
| Power Dissipation | — | 12.5 mW at 500 kSPS |
| SNR | — | 92 dB typical |
| INL | — | [DATA_NEEDED: INL] |
| DNL | — | [DATA_NEEDED: DNL] |
| Temperatura de funcionamiento | — | -40C to +125C |
| Marking Code | — | C02# |