AFS600-1FG256I vs M7AFS600-FG256I Comparación
Comparación detallada lado a lado de AFS600-1FG256I por Microchip Technology y M7AFS600-FG256I por Microchip Technology. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Microchip Technology
AFS600-1FG256I - 600K-Gate Fusion Mixed-Signal FPGA | Microchip
AFS600-1FG256I ✓ ActivoMicrochip Technology
M7AFS600-FG256I - 600K Gate Mixed-Signal FPGA | Microchip
M7AFS600-FG256I ✓ ActivoComparación de especificaciones
| Parámetro | AFS600-1FG256I | M7AFS600-FG256I |
|---|---|---|
| Marca | Microchip Technology | Microchip Technology |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Activo | Activo |
| Device Type | Fusion mixed-signal field-programmable gate array (FPGA) | — |
| System Gates | 600,000 gates | 600K |
| Logic Family | Flash-based CMOS | — |
| I/O Count | 119 I/O | — |
| Tensión de alimentación | 1.5 V | — |
| Process Technology | 130 nm CMOS | 130 nm |
| Metal Layers | 7 layers | — |
| Encapsulado | 256-LBGA, 1 mm pitch | — |
| Recuento de pines | 256 pins | — |
| Temperatura de funcionamiento | 0°C to 85°C | — |
| Configuration Memory | Nonvolatile flash | — |
| Power-Up Behavior | Live at power-up (LAPU) | — |
| Integrated Resources | Configurable analog, large flash memory blocks, clock generation and management | — |
| Programmable Logic | High-performance flash-based programmable logic | — |
| RoHS Compliance | [DATA_NEEDED: RoHS compliance status] | — |
| REACH Compliance | [DATA_NEEDED: REACH compliance status] | — |
| AEC-Q100 Qualification | [DATA_NEEDED: AEC-Q100 qualification status] | — |
| Junction Test Temperature | 100°C | — |
| Series | — | M7AFS600 (Fusion) |
| Logic Capacity (DigiKey listing) | — | 110592 |
| Number of I/O | — | 119 I/O |
| Embedded Processor | — | ARM CoreMP7 |
| Core Supply Voltage | — | 1.5 V |
| Encapsulado / Carcasa | — | 256-LBGA (FBGA) |
| Terminal Form | — | Ball |
| Package Shape | — | Square |
| Estilo de montaje | — | SMD/SMT |
| Minimum Operating Temperature | — | -40 C |
| Maximum Operating Temperature | — | +85 C |
| Packaging | — | Tray |
| Programmable Logic Type | — | Flash-based, non-volatile |
| Analog Integration | — | Mixed-signal (configurable analog + flash memory) |