AFS600-1FG256I vs M7AFS600-FG256I Comparaison
Comparaison détaillée côte à côte de AFS600-1FG256I par Microchip Technology et M7AFS600-FG256I par Microchip Technology. Comparez les spécifications clés, les paramètres électriques, le conditionnement, le statut de cycle de vie, les prix et la disponibilité pour déterminer le meilleur composant pour vos exigences de conception.
Microchip Technology
AFS600-1FG256I - 600K-Gate Fusion Mixed-Signal FPGA | Microchip
AFS600-1FG256I ✓ ActifMicrochip Technology
M7AFS600-FG256I - 600K Gate Mixed-Signal FPGA | Microchip
M7AFS600-FG256I ✓ ActifComparaison des spécifications
| Paramètre | AFS600-1FG256I | M7AFS600-FG256I |
|---|---|---|
| Marque | Microchip Technology | Microchip Technology |
| Catégorie | FPGA & CPLD | FPGA & CPLD |
| Statut du cycle de vie | Actif | Actif |
| Device Type | Fusion mixed-signal field-programmable gate array (FPGA) | — |
| System Gates | 600,000 gates | 600K |
| Logic Family | Flash-based CMOS | — |
| I/O Count | 119 I/O | — |
| Tension d'alimentation | 1.5 V | — |
| Process Technology | 130 nm CMOS | 130 nm |
| Metal Layers | 7 layers | — |
| Boîtier | 256-LBGA, 1 mm pitch | — |
| Nombre de broches | 256 pins | — |
| Température de fonctionnement | 0°C to 85°C | — |
| Configuration Memory | Nonvolatile flash | — |
| Power-Up Behavior | Live at power-up (LAPU) | — |
| Integrated Resources | Configurable analog, large flash memory blocks, clock generation and management | — |
| Programmable Logic | High-performance flash-based programmable logic | — |
| RoHS Compliance | [DATA_NEEDED: RoHS compliance status] | — |
| REACH Compliance | [DATA_NEEDED: REACH compliance status] | — |
| AEC-Q100 Qualification | [DATA_NEEDED: AEC-Q100 qualification status] | — |
| Junction Test Temperature | 100°C | — |
| Series | — | M7AFS600 (Fusion) |
| Logic Capacity (DigiKey listing) | — | 110592 |
| Number of I/O | — | 119 I/O |
| Embedded Processor | — | ARM CoreMP7 |
| Core Supply Voltage | — | 1.5 V |
| Boîtier / Format | — | 256-LBGA (FBGA) |
| Terminal Form | — | Ball |
| Package Shape | — | Square |
| Style de montage | — | SMD/SMT |
| Minimum Operating Temperature | — | -40 C |
| Maximum Operating Temperature | — | +85 C |
| Packaging | — | Tray |
| Programmable Logic Type | — | Flash-based, non-volatile |
| Analog Integration | — | Mixed-signal (configurable analog + flash memory) |