AFS600-FGG484 vs AFS600-FGG484I Comparación

Comparación detallada lado a lado de AFS600-FGG484 por Microchip Technology y AFS600-FGG484I por Microchip Technology. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.

Microchip Technology
AFS600-FGG484 AFS600-FGG484 - 600K-Gate Mixed-Signal FPGA | Microchip

AFS600-FGG484 - 600K-Gate Mixed-Signal FPGA | Microchip

AFS600-FGG484 ✓ Activo
Microchip Technology
AFS600-FGG484I AFS600-FGG484I - 600K Gate Mixed-Signal FPGA | Microchip

AFS600-FGG484I - 600K Gate Mixed-Signal FPGA | Microchip

AFS600-FGG484I Unknown

Comparación de especificaciones

Parámetro AFS600-FGG484 AFS600-FGG484I
Marca Microchip Technology Microchip Technology
Categoría FPGA & CPLD FPGA & CPLD
Estado del ciclo de vida Activo Unknown
Device Type Fusion mixed-signal FPGA Fusion mixed-signal FPGA
System Gates 600000 gates 600,000 gates
Maximum Frequency 1098.9 MHz —
Technology 130 nm —
Metal Layers 7 layers —
Process Flash-based CMOS —
Tensión de alimentación 1.5 V —
I/O Count 172 I/O —
Temperatura de funcionamiento 0 C to 70 C [DATA_NEEDED: operating temperature range]
Encapsulado 484-pin FBGA; one verified source alternatively labels BGA-256 —
Configuration Retention Nonvolatile flash —
Power-Up Feature Live at Power-Up (LAPU) —
Architecture Monolithic mixed-signal FPGA —
Programmable Logic High-performance flash-based programmable logic High-performance flash-based programmable logic
Analog Resources Configurable analog resources Integrated configurable analog blocks
Flash Memory Large flash-memory blocks —
Clocking Comprehensive clock generation and management circuitry —
Processor Support Optional ARM support —
Tipo de montaje Surface mount Surface mount
Estado del ciclo de vida [DATA_NEEDED: current lifecycle status] —
RoHS Compliance [DATA_NEEDED: RoHS compliance status] —
REACH Compliance [DATA_NEEDED: REACH compliance status] —
Number of I/O — 172 I/O
Total Package Pins — 484 pins
Package Type — 484-pin FBGA
Logic Family — CMOS
Core Supply Voltage — 1.5 V
Process Technology — 130 nm
Configuration Memory — Flash-based nonvolatile memory
Embedded Memory — Large flash memory blocks
Clock Management — Integrated clock generation and management circuitry
Estado RoHS — RoHS compliant
Lead-Free Status — Lead free
Programming Interface — [DATA_NEEDED: programming interface and supported tool versions]

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