ATSAM4SA16CB-CFN vs ATSAM4S8CB-CFN Comparación
Comparación detallada lado a lado de ATSAM4SA16CB-CFN por Microchip Technology y ATSAM4S8CB-CFN por Microchip Technology. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Microchip Technology
ATSAM4SA16CB-CFN - 120MHz Cortex-M4 MCU, 1MB Flash | Microchip
ATSAM4SA16CB-CFN ✓ ActivoMicrochip Technology
ATSAM4S8CB-CFN - 120MHz Cortex-M4 MCU, 512KB Flash, 100-VFBGA | Microchip
ATSAM4S8CB-CFN ✓ ActivoComparación de especificaciones
| Parámetro | ATSAM4SA16CB-CFN | ATSAM4S8CB-CFN |
|---|---|---|
| Marca | Microchip Technology | Microchip Technology |
| Categoría | Microcontrollers | Microcontrollers |
| Estado del ciclo de vida | Activo | Activo |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $5,18 | $4,74 |
| Manufacturer | Microchip Technology | — |
| Series | SAM4S | — |
| Core | ARM Cortex-M4 with FPU | ARM Cortex-M4 with FPU |
| Core Size | 32-Bit | — |
| Maximum CPU Frequency | 120 MHz | — |
| Program Memory Size | 1 MB (1M x 8) FLASH | — |
| RAM Size | 128 KB | — |
| Supply Voltage Range | 1.62 V to 3.6 V | 1.62 V to 3.6 V |
| Rango de temperatura de funcionamiento | -40 °C to +85 °C (Industrial) | — |
| Encapsulado | 100-VFBGA (7x7 mm) | 100-ball VFBGA, 7x7 mm, 0.65 mm pitch |
| Tipo de montaje | Surface Mount | Surface Mount (BGA) |
| Ball Pitch | 0.65 mm | — |
| Number of I/O | [DATA_NEEDED: exact GPIO count] | — |
| Connectivity | USB 2.0 FS, CAN, EMAC, MCI/SDIO, USART, SPI, TWI/I2C | — |
| Peripherals | Brown-out Detect, DMA, POR, PWM, WDT | — |
| ADC | 12-bit, up to 24 channels | 12-bit, up to 16 channels, 1 Msps |
| Data Converters | A/D 24x12b; D/A [DATA_NEEDED] | — |
| Nivel MSL | 3 (168 hours) | — |
| Estado RoHS | Compliant | Compliant |
| Lead-Free / Halogen-Free | Yes / [DATA_NEEDED] | — |
| Silicon Revision | B (recommended for new designs) | — |
| Oscillator Type | Internal | — |
| Core Architecture | — | ARM 32-bit RISC |
| Frecuencia de reloj máxima | — | 120 MHz |
| Program Memory (Flash) | — | 512 KB (512K x 8) |
| SRAM | — | 128 KB |
| Operating Temperature (Industrial) | — | -40C to +85C |
| Operating Temperature (Green, MRL B) | — | -40C to +105C |
| USB | — | USB 2.0 Full-Speed Device with on-chip transceiver |
| CAN | — | 2x CAN 2.0A/B controllers |
| DAC | — | 2x 12-bit DAC |
| Timers | — | Multiple 16-bit and 32-bit timers, PWM, RTC |
| Communication Interfaces | — | UART/USART, SPI, TWI (I2C), I2S, USB, CAN |
| External Bus Interface | — | 16-bit Static Memory Controller (EBI) |
| Supply Current (Active, 100 MHz) | — | approximately 30 mA |
| Supply Current (Backup, RTC) | — | approximately 3 uA at 1.8 V |
| MSL (Moisture Sensitivity) | — | MSL3 (per BGA package) |