ATSAM4SA16CB-CFN vs ATSAM4S8CB-CFN Comparaison
Comparaison détaillée côte à côte de ATSAM4SA16CB-CFN par Microchip Technology et ATSAM4S8CB-CFN par Microchip Technology. Comparez les spécifications clés, les paramètres électriques, le conditionnement, le statut de cycle de vie, les prix et la disponibilité pour déterminer le meilleur composant pour vos exigences de conception.
Microchip Technology
ATSAM4SA16CB-CFN - 120MHz Cortex-M4 MCU, 1MB Flash | Microchip
ATSAM4SA16CB-CFN ✓ ActifMicrochip Technology
ATSAM4S8CB-CFN - 120MHz Cortex-M4 MCU, 512KB Flash, 100-VFBGA | Microchip
ATSAM4S8CB-CFN ✓ ActifComparaison des spécifications
| Paramètre | ATSAM4SA16CB-CFN | ATSAM4S8CB-CFN |
|---|---|---|
| Marque | Microchip Technology | Microchip Technology |
| Catégorie | Microcontrollers | Microcontrollers |
| Statut du cycle de vie | Actif | Actif |
| Statut du stock | In Stock | In Stock |
| Prix unitaire (USD) | $5,18 | $4,74 |
| Manufacturer | Microchip Technology | — |
| Series | SAM4S | — |
| Core | ARM Cortex-M4 with FPU | ARM Cortex-M4 with FPU |
| Core Size | 32-Bit | — |
| Maximum CPU Frequency | 120 MHz | — |
| Program Memory Size | 1 MB (1M x 8) FLASH | — |
| RAM Size | 128 KB | — |
| Supply Voltage Range | 1.62 V to 3.6 V | 1.62 V to 3.6 V |
| Plage de température de fonctionnement | -40 °C to +85 °C (Industrial) | — |
| Boîtier | 100-VFBGA (7x7 mm) | 100-ball VFBGA, 7x7 mm, 0.65 mm pitch |
| Type de montage | Surface Mount | Surface Mount (BGA) |
| Ball Pitch | 0.65 mm | — |
| Number of I/O | [DATA_NEEDED: exact GPIO count] | — |
| Connectivity | USB 2.0 FS, CAN, EMAC, MCI/SDIO, USART, SPI, TWI/I2C | — |
| Peripherals | Brown-out Detect, DMA, POR, PWM, WDT | — |
| ADC | 12-bit, up to 24 channels | 12-bit, up to 16 channels, 1 Msps |
| Data Converters | A/D 24x12b; D/A [DATA_NEEDED] | — |
| Niveau MSL | 3 (168 hours) | — |
| Statut RoHS | Compliant | Compliant |
| Lead-Free / Halogen-Free | Yes / [DATA_NEEDED] | — |
| Silicon Revision | B (recommended for new designs) | — |
| Oscillator Type | Internal | — |
| Core Architecture | — | ARM 32-bit RISC |
| Fréquence d'horloge maximale | — | 120 MHz |
| Program Memory (Flash) | — | 512 KB (512K x 8) |
| SRAM | — | 128 KB |
| Operating Temperature (Industrial) | — | -40C to +85C |
| Operating Temperature (Green, MRL B) | — | -40C to +105C |
| USB | — | USB 2.0 Full-Speed Device with on-chip transceiver |
| CAN | — | 2x CAN 2.0A/B controllers |
| DAC | — | 2x 12-bit DAC |
| Timers | — | Multiple 16-bit and 32-bit timers, PWM, RTC |
| Communication Interfaces | — | UART/USART, SPI, TWI (I2C), I2S, USB, CAN |
| External Bus Interface | — | 16-bit Static Memory Controller (EBI) |
| Supply Current (Active, 100 MHz) | — | approximately 30 mA |
| Supply Current (Backup, RTC) | — | approximately 3 uA at 1.8 V |
| MSL (Moisture Sensitivity) | — | MSL3 (per BGA package) |