ATSAM4SD32CA-CU vs ATSAM4SD32CA-CUR Comparación
Comparación detallada lado a lado de ATSAM4SD32CA-CU por Microchip Technology y ATSAM4SD32CA-CUR por Microchip Technology. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Microchip Technology
ATSAM4SD32CA-CU - 120MHz Cortex-M4 MCU 2MB Flash 100-TFBGA | Microchip
ATSAM4SD32CA-CU ✓ ActivoMicrochip Technology
ATSAM4SD32CA-CUR - 120MHz Cortex-M4 MCU 2MB Flash | Microchip
ATSAM4SD32CA-CUR ✓ ActivoComparación de especificaciones
| Parámetro | ATSAM4SD32CA-CU | ATSAM4SD32CA-CUR |
|---|---|---|
| Marca | Microchip Technology | Microchip Technology |
| Categoría | Microcontrollers | Microcontrollers |
| Estado del ciclo de vida | Activo | Activo |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $8,62 | $8,45 |
| Core Architecture | ARM Cortex-M4 with FPU | — |
| Frecuencia de reloj máxima | 120 MHz | — |
| Instruction Cache | 2 KB | — |
| Program Memory (Flash) | 2 MB (2M x 8) | — |
| SRAM | 160 KB | 160 KB |
| Supply Voltage Range | 1.62 V to 3.6 V | — |
| Encapsulado | 100-ball TFBGA (9x9 mm) | 100-ball TFBGA (9x9 mm) |
| Rango de temperatura de funcionamiento | -40 C to +85 C (industrial) | — |
| ADC | 10-bit, up to 16 channels, 1 MSps | 16-bit, up to 24 channels, 1 Msps |
| USB Interface | USB 2.0 Full-Speed Device/Host/OTG | — |
| CAN | 2 x CAN 2.0A/B | — |
| USART | 3 x USART | — |
| TWI (I2C-compatible) | 2 x TWI | — |
| SPI | 2 x SPI | — |
| Memory Protection Unit (MPU) | Yes | — |
| DSP Extensions | Yes (single-precision FPU + MAC) | — |
| Pin-to-Pin Compatibility | SAM3N, SAM3S, SAM7S legacy 64/100-pin variants | — |
| Tipo de montaje | Surface Mount (TFBGA) | Surface Mount (Tape & Reel) |
| Estado RoHS | Compliant | Compliant |
| Core | — | ARM Cortex-M4 with FPU |
| Maximum CPU Clock | — | 120 MHz |
| Program Memory | — | 2 MB Flash |
| Backup SRAM | — | 2 KB |
| Supply Voltage (VDDIO/VDD) | — | 1.62 V to 3.6 V |
| Core Voltage (internal LDO) | — | 1.2 V |
| Number of I/O Pins | — | Up to 79 |
| Temperatura de funcionamiento | — | -40 C to +85 C (Industrial) |
| USB | — | USB 2.0 Full-Speed Device/Host with on-chip PHY |
| Ethernet MAC | — | 10/100 Mbps MII/RMII |
| Nivel MSL | — | 3 (168 hours) |
| Process Technology | — | [DATA_NEEDED: process node] |