ATSAM4SD32CA-CUR - 120MHz Cortex-M4 MCU 2MB Flash | Microchip
N.º de pieza: ATSAM4SD32CA-CUR ✓ Activo| Cant. | Precio unitario | Total |
|---|---|---|
| 1 | $12.85 | $12,85 |
| 10 | $11.62 | $116,20 |
| 100 | $10.4 | $1.040,00 |
| 500 | $9.21 | $4.605,00 |
| 1.000 | $8.45 | $8.450,00 |
ATSAM4SD32CA-CUR Descripción general
A microcontroller (MCU) is an integrated circuit that combines a processor core, program and data memory, peripherals, and I/O on a single silicon die. ARM Cortex-M4 cores implement the Thumb-2 instruction set with hardware single-cycle multiply and optional single-precision FPU, fitting between Cortex-M0+ (lowest power) and Cortex-M7 (highest performance) in the Cortex-M hierarchy. Within power-management IC taxonomy, MCUs belong to the broader category of embedded processors / microcontrollers, sitting alongside DSPs, FPGAs, and application processors.
Key features of the ATSAM4SD32CA-CUR include its 120 MHz maximum CPU clock, single-cycle DSP MAC instructions, 2 MB Flash with security and secure boot, 160 KB SRAM (plus 2 KB backup SRAM), and 1.2 V internal core voltage supplied by an on-chip voltage regulator from a single 1.62-3.6 V external supply. The device provides up to 79 GPIO, up to 25 communication channels (USART, SPI, TWI), and a 10/100 Ethernet MAC with MII/RMII interface.
The architecture uses a multi-layer AHB bus matrix with separate bridges for code and data, eliminating contention between CPU and DMA. A peripheral DMA controller (PDC) with up to 24 channels enables zero-CPU-overhead data movement between peripherals and memory. The on-chip Flash is mapped at 0x00400000 and supports in-application programming via the SAM-BA bootloader.
Typical applications include industrial control (PLC, motor drives, HMI), consumer audio (USB speakers, headphones, audio docks), smart energy metering, building automation gateways, and connected IoT edge nodes requiring USB connectivity. The combination of 2 MB code space and high-speed ADC also suits data-acquisition loggers and portable instrumentation.
Design consideration: the 100-ball TFBGA requires a 4-layer PCB minimum with matched-length impedance control on USB/Ethernet differential pairs; place decoupling capacitors (100 nF + 4.7 µF) within 2 mm of every VDD pin to meet IEC 61967 EMI margins.
This page synthesizes XAIPART distributor pricing, drop-in same-package alternatives from the SAM4S and SAM4S16A families, and design notes not found in the manufacturer datasheet.
Alternativas directas para ATSAM4SD32CA-CUR — mismo encapsulado, compatible pin a pin. Se excluyen las piezas de otro encapsulado que requieren retrabajo de la PCB.
Variantes de esta serie
Modelos de la misma serie compatibles directamente con ATSAM4SD32CA-CUR (mismo factor de forma y huella) — difiere en ADC, Mounting Type, Package, Program Memory (Flash), Core Architecture.
Herramienta de comparación rápida — seleccione piezas alternativas para compararlas lado a lado:
ATSAM4SD32CA-CUR-Q
✅ Sustitución directa📋 Alternativa de referencia (no en el catálogo)
ATSAM4S16CA-CUR
✅ Sustitución directa📋 Alternativa de referencia (no en el catálogo)
ATSAM4S8CA-CU
✅ Sustitución directa✓ En stock
$6.18 / unidad
Ver hoja de datos →ATSAM4SD32CA-AUR
✅ Sustitución directa✓ En stock
$8.45 / unidad
Ver hoja de datos →ATSAM4SD32CA-CU
✅ Sustitución directa✓ En stock
$8.62 / unidad
Ver hoja de datos →ATSAM4SD16CA-CUR
✅ Sustitución directa ⚠️ Especificaciones sin verificar✓ En stock
$5.55 / unidad
Ver hoja de datos →ATSAM4SD32CA-CUR Valores máximos y características eléctricas
| Core | ARM Cortex-M4 with FPU |
| Maximum CPU Clock | 120 MHz |
| Program Memory | 2 MB Flash |
| SRAM | 160 KB |
| Backup SRAM | 2 KB |
| Supply Voltage (VDDIO/VDD) | 1.62 V to 3.6 V |
| Core Voltage (internal LDO) | 1.2 V |
| Number of I/O Pins | Up to 79 |
| Encapsulado | 100-ball TFBGA (9x9 mm) |
| Tipo de montaje | Surface Mount (Tape & Reel) |
| Temperatura de funcionamiento | -40 C to +85 C (Industrial) |
| ADC | 16-bit, up to 24 channels, 1 Msps |
| USB | USB 2.0 Full-Speed Device/Host with on-chip PHY |
| Ethernet MAC | 10/100 Mbps MII/RMII |
| Estado RoHS | Compliant |
| Nivel MSL | 3 (168 hours) |
Guía de configuración de pines de ATSAM4SD32CA-CUR 100-ball tfbga (9x9 mm)
Configuración de pines para ATSAM4SD32CA-CUR (encapsulado 100-ball tfbga (9x9 mm)). Este CI digital incluye GPIO, interfaces de comunicación (UART, SPI, I2C) y pines de alimentación. Consulte la hoja de datos del fabricante para conocer las funciones alternativas de los pines y las opciones de configuración. Esencial para el diseño de sistemas embebidos y el diseño de PCB.
No hay datos detallados de patillaje disponibles para ATSAM4SD32CA-CUR.
Consulte la hoja de datos para ver la configuración completa de patillas.
Aplicaciones típicas
ATSAM4SD32CA-CUR es adecuado para 6 aplicacións: Industrial Control and HMI, USB Audio Devices, Smart Energy Metering, Building Automation Gateways, Data Acquisition Loggers, Motor Drive Controllers.
Industrial Control and HMI
The ATSAM4SD32CA-CUR fits industrial PLC and HMI panels because its 120 MHz Cortex-M4 with FPU executes single-cycle DSP MAC instructions in real time, while 2 MB Flash accommodates full IEC 61131-3 runtime plus graphical HMI assets. The 16-bit ADC at 1 Msps captures analog sensor inputs for closed-loop control. The 100-ball TFBGA is small enough for compact panel-mount designs, and the industrial -40 to +85 C operating range covers factory-floor environments. The on-chip 10/100 Ethernet MAC enables Modbus TCP and EtherNet/IP gateway integration.
Recomendado
USB Audio Devices
The ATSAM4SD32CA-CUR is well-suited to USB speakers, USB headphones, and USB audio docks because it integrates a USB 2.0 Full-Speed device/host controller with on-chip PHY, eliminating the need for an external transceiver. The Cortex-M4 DSP extensions handle sample-rate conversion and audio mixing without CPU overhead. The 2 MB Flash stores USB audio class firmware plus optional DSP effects libraries. Compared to a discrete USB audio codec approach, the integrated solution reduces BOM and PCB area, though it requires careful impedance-controlled USB DP/DN routing per USB 2.0 spec.
Recomendado
Smart Energy Metering
The ATSAM4SD32CA-CUR suits single-phase and polyphase smart energy meters because its 16-bit ADC captures current and voltage waveforms simultaneously while the Cortex-M4 DSP extensions execute power-quality calculations (RMS, harmonic analysis, FFT) in real time. The 2 MB Flash stores metering firmware, calibration tables, and DLMS/COSEM communication stacks. The 160 KB SRAM buffers sampled waveform data without DMA contention. The industrial temperature range and on-chip RTC with backup domain support tamper detection and time-of-use billing.
Recomendado
Building Automation Gateways
The ATSAM4SD32CA-CUR fits BACnet, KNX, and Modbus building-automation gateways because its multiple USART, SPI, and TWI interfaces support concurrent fieldbus connections. The 10/100 Ethernet MAC provides the IP backbone, and 2 MB Flash stores the full protocol stack plus web-based configuration UI. The Cortex-M4 handles JSON parsing for REST API integration with cloud BMS platforms. Compared to a multi-MCU approach, the single-chip design lowers BOM cost and simplifies EMC compliance.
Recomendado
Data Acquisition Loggers
The ATSAM4SD32CA-CUR suits portable data-acquisition loggers because its 1 Msps 16-bit ADC captures multi-channel analog data while 160 KB SRAM buffers samples between SD card writes via SPI. The 2 MB Flash stores the acquisition firmware and on-device analysis scripts. The peripheral DMA controller moves ADC samples to memory without CPU intervention, leaving the Cortex-M4 free for FFT and statistical processing. Battery operation is supported by the on-chip voltage regulator with low-power modes down to a few µA in backup mode.
Recomendado
Motor Drive Controllers
The ATSAM4SD32CA-CUR serves as a low-cost motor-drive controller for BLDC, PMSM, and stepper applications in sub-1 kW ranges. The Cortex-M4 DSP extensions execute single-cycle Park/Clarke transforms and space-vector PWM generation, while the 16-bit ADC samples phase currents synchronously with PWM. The 2 MB Flash stores sensorless FOC libraries plus application code, and the industrial temperature range covers integrated motor-module environments. A separate gate driver IC like the IRS2003 is required for the high-voltage power stage.
Recomendado
Resumen de productos recomendados
Datos de referencia de ingeniería para ATSAM4SD32CA-CUR — comparación, orientación de diseño e información de cumplimiento.
Guía de selección
Comparación con alternativas
| Parámetro | Este producto | ATSAM4SD32CA-CUR-Q | ATSAM4S16CA-CUR | ATSAM4S8CA-CU | ATSAM4SD32CA-AUR | ATSAM4SD32CA-CU |
|---|---|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | 100-TFBGA (9x9 mm) | 100-TFBGA (9x9 mm) - same | 100-TFBGA (9x9 mm) - same | 100-TFBGA (9x9 mm) - same | 100-TFBGA (9x9 mm) - same | 100-TFBGA (9x9 mm) - same |
| Flash Memory | 2 MB | 2 MB | 1 MB (-50%) | 512 KB (-75%) | 2 MB | 2 MB |
| SRAM | 160 KB | 160 KB | 160 KB | 128 KB (-20%) | 160 KB | 160 KB |
| Maximum CPU Clock | 120 MHz | 120 MHz | 120 MHz | 120 MHz | 120 MHz | 120 MHz |
| Automotive Grade (AEC-Q100) | No | Yes (AEC-Q100) | No | No | No | No |
| Operating Temperature | -40C to +85C | -40C to +105C (Grade 2) | -40C to +85C | -40C to +85C | -40C to +85C | -40C to +85C |
| Packaging Form | Tape & Reel (13-inch) | Tape & Reel | Tape & Reel | Tray (CU suffix) | Tape & Reel (AUR suffix) | Tray (CU suffix) |
Diferenciadores clave
- Largest Flash density in SAM4S TFBGA-100 family (frente a ATSAM4S16CA-CUR)
- Automotive-qualified drop-in variant available (frente a ATSAM4SD32CA-CUR-Q)
- Same family architecture as ATSAM4S16CA-CUR with larger memory (frente a ATSAM4S8CA-CU)
Notas de diseño
The 100-ball TFBGA package requires a minimum 4-layer PCB with continuous GND plane beneath the BGA for both power delivery and thermal dissipation. Route the USB DP/DN differential pair with 90 ohm differential impedance and matched length within 150 mils to meet USB 2.0 spec. Place 100 nF + 4.7 uF decoupling capacitors within 2 mm of every VDD/VDDIO ball pair. Use 0.5 mm pitch BGA escape routing on the top layer with microvia-in-pad if available; otherwise dog-bone fanout requires 0.8 mm pitch minimum trace/space.
Estimated: at 120 MHz with all peripherals active, the ATSAM4SD32CA-CUR dissipates approximately 200-300 mW in normal operation. The TFBGA-100 package has a typical theta_JA of 30-35 C/W on a 4-layer JEDEC test board, yielding a junction-temperature rise of 6-10 C above ambient at typical industrial operating conditions. For sealed enclosures without airflow, derate CPU clock or duty-cycle peripherals to maintain junction temperature below 100 C (TJ_max = 125 C, leaving 25 C margin).
Do not apply power to the ATSAM4SD32CA-CUR without first programming the supply controller - brown-out during Flash programming can corrupt the Flash content lock bits and brick the device until a full chip erase. Always use the SAM-BA bootloader or JTAG/SWD with a verified image before disconnecting the debugger. Avoid using NRST as a GPIO on prototype boards - early Atmel errata documents flagged pin-contention issues if NRST is repurposed before the bootloader completes initialization.
The ATSAM4SD32CA-CUR has separate VDDIO (1.62-3.6 V) and VDDCORE pins - VDDCORE is supplied by the on-chip 1.2 V regulator from VDDIO but requires an external 1 uF + 100 nF decoupling pair close to the balls. In backup mode (RTC running, CPU off), current drops to approximately 2-4 uA at 3.3 V. Use the supply controller (SUPC) sleepwalking mode to wake on RTC alarm while keeping RAM retention.
Información de cumplimiento
RoHS compliant per Microchip product page. Standard grade is not AEC-Q100 - choose ATSAM4SD32CA-CUR-Q for automotive.
