ATSAMA5D27-SOM1-EK1 vs ATSAMA5D27A-CU Comparación
Comparación detallada lado a lado de ATSAMA5D27-SOM1-EK1 por Microchip Technology y ATSAMA5D27A-CU por Microchip Technology. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Microchip Technology
ATSAMA5D27-SOM1-EK1 - SAMA5D27 ARM Cortex-A5 500MHz Eval Kit
ATSAMA5D27-SOM1-EK1 ✓ ActivoMicrochip Technology
ATSAMA5D27A-CU - 500MHz Cortex-A5 MPU | Microchip | Embedded
ATSAMA5D27A-CU ✓ ActivoComparación de especificaciones
| Parámetro | ATSAMA5D27-SOM1-EK1 | ATSAMA5D27A-CU |
|---|---|---|
| Marca | Microchip Technology | Microchip Technology |
| Categoría | Development Boards | Microcontrollers |
| Estado del ciclo de vida | Activo | Activo |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $148,88 | $7,83 |
| Product Type | Embedded Evaluation Board / Development Kit | — |
| Target Module | ATSAMA5D27-SOM1 | — |
| Embedded SiP | ATSAMA5D27C-D1G-CU (Cortex-A5 + 1-Gbit DDR2) | — |
| Processor Core | ARM Cortex-A5 | — |
| Maximum Core Frequency | 500 MHz | — |
| DDR2 SDRAM | 1 Gbit (128 MB) on SiP | — |
| NOR Flash | 64 Mbit | — |
| EEPROM | 1 Kbit | — |
| Operating System Support | Linux, RTOS (Buildroot, Yocto, mainline Linux) | — |
| Debug Interface | On-board debugger, JTAG/SWD headers | — |
| Connectivity | USB Host/Device, GMII/RGMII Ethernet expansion, CAN, SD/MMC x2, mikroBUS x2, Audio codec, LCD/touch connector | — |
| Expansion Headers | 0.1-inch headers mapping SAMA5D2 peripheral pins | — |
| Documentation | 60-page SAMA5D27 SOM1 Kit1 User's Guide | — |
| Tipo de montaje | Through-hole / desktop development board | Surface Mount |
| Estado RoHS | Compliant | Compliant |
| Core Architecture | — | ARM Cortex-A5 (ARMv7-A) with NEON |
| Operating Frequency | — | 500 MHz |
| Core Count / Data Bus Width | — | 1 Core / 32-bit |
| Internal SRAM | — | 128 KB |
| External Memory Support | — | DDR2, DDR3L, LPDDR2, LPDDR3, QSPI, e.MMC, NAND |
| Encapsulado | — | 289-LFBGA (14x14 mm, 0.8 mm pitch) |
| Tensión de alimentación | — | 3.3 V I/O, 1.2 V core (typ.) |
| Backup Mode Current | — | <5 µA |
| Temperatura de funcionamiento | — | -40 °C to +85 °C (industrial) |
| Cryptography | — | AES, SHA, TRNG, secure boot |
| Display Interface | — | LCD controller, MIPI-DSI option |
| Touch Controller | — | Integrated Peripheral Touch Controller (PTC) |
| Communication Interfaces | — | CAN, HSIC, USB, EMAC, FLEXCOM x12 (UART/SPI/TWI) |
| Nivel MSL | — | 3 |
| Lead-Free | — | Yes |