ATSAMA5D27A-CU - 500MHz Cortex-A5 MPU | Microchip | Embedded
N.º de pieza: ATSAMA5D27A-CU ✓ Activo| Cant. | Precio unitario | Total |
|---|---|---|
| 1 | $11.42 | $11,42 |
| 10 | $10.55 | $105,50 |
| 100 | $9.28 | $928,00 |
| 500 | $8.51 | $4.255,00 |
| 1.000 | $7.83 | $7.830,00 |
ATSAMA5D27A-CU Descripción general
An ARM Cortex-A5 MPU is a microprocessor unit based on the ARM Cortex-A5 application-class core, sitting above microcontrollers (MCUs) in the embedded processing hierarchy: MCU -> Cortex-M core -> Cortex-A5 MPU -> Cortex-A7/A53/A72 application processors. Cortex-A5 supports the ARMv7-A architecture with optional NEON SIMD and hardware floating-point, enabling full Linux and Android distributions while maintaining low power consumption ideal for battery-backed and industrial installations.
Key features include 500 MHz core speed with 128 KB SRAM, support for DDR2/DDR3L/LPDDR2/LPDDR3 external memory, and multiple boot sources (QSPI flash, e.MMC, NAND, SD card). The device integrates an LCD controller with TFT/MIPI-DSI support, a 12-bit ADC, 12-bit DAC, audio subsystem, and a Peripheral Touch Controller (PTC). Hardware security features include AES (with on-the-fly encryption for external memories), secure boot, and a true random number generator, enabling tamper-resistant IoT edge nodes.
The SAMA5D2 architecture combines an ARM Cortex-A5 core with a high-bandwidth multi-layer bus matrix, dual QSPI controllers with XIP, and up to 12 FLEXCOM serial interfaces (each configurable as UART/USART/SPI/TWI). The 0.8 mm ball pitch simplifies PCB layout compared with finer-pitch alternatives, while integrated power management keeps external component count low. According to Microchip's SAMA5D2 datasheet, the device draws under 5 µA in backup mode, supporting extensive battery life for always-on applications.
Typical applications include industrial IoT gateways, home and building automation HMI panels, smart energy meters, medical point-of-care devices, and ruggedized handheld terminals. The combination of Linux capability, hardware crypto, and an LCD controller allows a single-chip design without external companion MPUs.
When designing with the ATSAMA5D27A-CU, ensure the PCB uses microvia technology for the 0.8 mm BGA escape routing and that the DDR interface is length-matched within 25 mils across byte lanes. The integrated PTC requires careful PCB layout guard-ring routing for moisture immunity in touch-button or touch-slider designs.
This page synthesizes real-time distributor pricing, drop-in same-package alternatives, comparison tables, and practical PCB design notes that go beyond the manufacturer datasheet, giving embedded engineers a decision-ready view of the SAMA5D2 family.
Alternativas directas para ATSAMA5D27A-CU — mismo encapsulado, compatible pin a pin. Se excluyen las piezas de otro encapsulado que requieren retrabajo de la PCB.
Variantes de esta serie
Modelos de la misma serie compatibles directamente con ATSAMA5D27A-CU (mismo factor de forma y huella) — difiere en Ethernet, Package, Operating Temperature, USB, CAN.
Herramienta de comparación rápida — seleccione piezas alternativas para compararlas lado a lado:
ATSAMA5D27A-CNR
✅ Sustitución directa✓ En stock
$10.95 / unidad
Ver hoja de datos →ATSAMA5D27A-CN
✅ Sustitución directa✓ En stock
$20.5 / unidad
Ver hoja de datos →ATSAMA5D27A-CUR
✅ Sustitución directa✓ En stock
$12.95 / unidad
Ver hoja de datos →ATSAMA5D27B-CU
✅ Sustitución directa✓ En stock
$11.85 / unidad
Ver hoja de datos →ATSAMA5D27C-D1G
✅ Sustitución directa📋 Alternativa de referencia (no en el catálogo)
ATSAMA5D27A-CU Valores máximos y características eléctricas
| Core Architecture | ARM Cortex-A5 (ARMv7-A) with NEON |
| Operating Frequency | 500 MHz |
| Core Count / Data Bus Width | 1 Core / 32-bit |
| Internal SRAM | 128 KB |
| External Memory Support | DDR2, DDR3L, LPDDR2, LPDDR3, QSPI, e.MMC, NAND |
| Encapsulado | 289-LFBGA (14x14 mm, 0.8 mm pitch) |
| Tipo de montaje | Surface Mount |
| Tensión de alimentación | 3.3 V I/O, 1.2 V core (typ.) |
| Backup Mode Current | <5 µA |
| Temperatura de funcionamiento | -40 °C to +85 °C (industrial) |
| Cryptography | AES, SHA, TRNG, secure boot |
| Display Interface | LCD controller, MIPI-DSI option |
| Touch Controller | Integrated Peripheral Touch Controller (PTC) |
| Communication Interfaces | CAN, HSIC, USB, EMAC, FLEXCOM x12 (UART/SPI/TWI) |
| Estado RoHS | Compliant |
| Nivel MSL | 3 |
| Lead-Free | Yes |
Guía de configuración de pines de ATSAMA5D27A-CU 289-lfbga (14x14 mm, 0.8 mm pitch)
Configuración de pines para ATSAMA5D27A-CU (encapsulado 289-lfbga (14x14 mm, 0.8 mm pitch)). Este CI digital incluye GPIO, interfaces de comunicación (UART, SPI, I2C) y pines de alimentación. Consulte la hoja de datos del fabricante para conocer las funciones alternativas de los pines y las opciones de configuración. Esencial para el diseño de sistemas embebidos y el diseño de PCB.
No hay datos detallados de patillaje disponibles para ATSAMA5D27A-CU.
Consulte la hoja de datos para ver la configuración completa de patillas.
Aplicaciones típicas
ATSAMA5D27A-CU es adecuado para 6 aplicacións: Industrial IoT Gateway, HMI Touch Panel, Smart Energy Meter, Medical Point-of-Care Device, Ruggedized Handheld Terminal, Building Automation Controller.
Industrial IoT Gateway
The ATSAMA5D27A-CU is purpose-built for industrial IoT gateways, where its 500 MHz ARM Cortex-A5 core runs full Linux with networking stacks while the integrated EMAC, HSIC, and CAN-FD peripherals aggregate field-bus traffic. The hardware AES/SHA accelerators with on-the-fly external memory encryption protect MQTT payloads without CPU overhead. Designers benefit from the -40 °C to +85 °C industrial temperature grade and Microchip's long-term 10-year supply commitment. Typical power dissipation at 1.2 V core runs under 1 W at full CPU load, enabling fanless enclosures.
Recomendado
HMI Touch Panel
For human-machine interface (HMI) panels with capacitive touch, the ATSAMA5D27A-CU integrates both an LCD controller (TFT and MIPI-DSI bridge) and a Peripheral Touch Controller (PTC) that supports mutual-capacitance touch sensors with moisture immunity. The 128 KB on-chip SRAM reduces DDR traffic for button-press debouncing and gesture recognition. Linux with the Qt or LVGL framework delivers smooth 60 fps updates on WXGA panels. The 0.8 mm BGA pitch simplifies four-layer PCB routing with microvias, lowering BOM cost compared with finer-pitch alternatives.
Recomendado
Smart Energy Meter
Smart electricity and water meters benefit from the ATSAMA5D27A-CU's sub-5 µA backup current, which keeps RTC time during battery-only operation across extended outages. The integrated 12-bit ADC pairs with external current-sense amplifiers for metrology accuracy, while AES hardware encryption secures AMI/HAN communications. The 500 MHz Cortex-A5 with NEON executes metering algorithms and TLS handshakes concurrently. Industrial temperature support and a 10-year Microchip longevity commitment align with utility product lifecycles.
Recomendado
Medical Point-of-Care Device
Point-of-care diagnostic instruments require deterministic response under battery power with secure data handling - a perfect match for the ATSAMA5D27A-CU. The Cortex-A5 runs embedded Linux or Android Medical device frameworks, while hardware SHA/AES ensures HIPAA-compliant data at rest. The integrated LCD and touch controllers drive operator-facing displays without external companion ICs. Fanless operation is enabled by the 1 W-class typical power budget, allowing sealed enclosures required for infection control in clinical settings.
Recomendado
Ruggedized Handheld Terminal
Rugged handheld scanners, logistics terminals, and field-service tablets rely on the ATSAMA5D27A-CU's industrial temperature grade, hardware security, and integrated LCD/touch to deliver commercial-off-the-shelf reliability. The 12 FLEXCOM serial interfaces each reconfigure as UART/SPI/TWI, simplifying scanner and RFID-reader integrations. Microchip's 0.8 mm BGA package withstands drop and vibration testing better than fine-pitch alternatives. Full Linux support enables long-term in-field OTA updates without firmware fragmentation.
Recomendado
Building Automation Controller
Building automation hubs aggregate HVAC, lighting, security, and access-control subsystems - workloads well-served by the ATSAMA5D27A-CU. The hardware CAN-FD interface connects directly to BACnet and KNX field buses via external transceivers, while USB and EMAC provide IP-network backhaul. The integrated PTC supports glass-front touch panels found in modern thermostats and access readers. Microchip's longevity program protects the multi-decade lifecycles typical of commercial building installations.
Recomendado
Resumen de productos recomendados
Datos de referencia de ingeniería para ATSAMA5D27A-CU — comparación, orientación de diseño e información de cumplimiento.
Guía de selección
Comparación con alternativas
| Parámetro | Este producto | ATSAMA5D27A-CNR | ATSAMA5D27A-CN | ATSAMA5D27A-CUR | ATSAMA5D27B-CU | ATSAMA5D27C-D1G |
|---|---|---|---|---|---|---|
| Package | 289-LFBGA (14x14) | 289-LFBGA (14x14) | 289-LFBGA (14x14) | 289-LFBGA (14x14) | 289-LFBGA (14x14) | 289-LFBGA (14x14) |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Core | ARM Cortex-A5 | ARM Cortex-A5 | ARM Cortex-A5 | ARM Cortex-A5 | ARM Cortex-A5 | ARM Cortex-A5 |
| Operating Frequency | 500 MHz | 500 MHz | 500 MHz | 500 MHz | 500 MHz | 500 MHz |
| Internal SRAM | 128 KB | 128 KB | 128 KB | 128 KB | 128 KB | 128 KB |
| Temperature Range | -40 °C to +85 °C (Industrial) | -40 °C to +105 °C (Auto) | -40 °C to +85 °C | -40 °C to +85 °C | -40 °C to +85 °C | -40 °C to +85 °C |
| Silicon Revision | A | A | A | A | B | C |
| Integrated DRAM | None (external DDR) | None (external DDR) | None (external DDR) | None (external DDR) | None (external DDR) | 1 Gbit DDR2 integrated |
| Unit Price (qty-100) | $9.28 | $10.10 | $9.28 | $9.28 | $8.80 | $14.50 |
Diferenciadores clave
- Hardware cryptography with OTF memory encryption (frente a ATSAMA5D27C-D1G)
- Broader industrial temperature headroom option (frente a ATSAMA5D27A-CU vs ATSAMA5D27A-CN)
- Mature production silicon with broadest third-party support (frente a ATSAMA5D27B-CU)
Notas de diseño
The 289-LFBGA uses a 0.8 mm ball pitch, which is escape-routable on a standard 4-layer PCB with microvia-in-pad technology (e.g., 1.0 mm laser-drilled microvias). For cost-sensitive designs, an 8-layer PCB with stacked microvias improves yield but increases fabrication cost. Reference Microchip's SAMA5D2 Xplained Ultra design files for an approved escape pattern. Decoupling requires 100 nF X7R capacitors within 3 mm of each VDDCORE/VDDIO power ball pair, plus bulk 10 µF and 47 µF tantalum capacitors near the package edges.
The DDR2/DDR3L/LPDDR2/LPDDR3 interface demands strict length matching - data (DQ), data strobe (DQS), and clock (CK) signals must be matched within ±25 mils of the byte-lane target per byte lane. Route the DDR interface on the top layer directly under the BGA escape with continuous reference ground plane; never cross a plane split. For LPDDR2/3, add a 100 Ω differential termination resistor pack near the MPU. Source-synchronous timing margins shrink to <50 ps, making signal-integrity simulation mandatory for 500 MHz operation.
Estimated: At maximum CPU activity, the 1.2 V core draws approximately 600 mA, dissipating about 720 mW, while the 3.3 V I/O adds ~150 mW with all peripherals enabled - total ~870 mW. With the 289-LFBGA's typical θJA of ~22 °C/W on a JEDEC 4-layer test board, junction temperature rises ~19 °C above ambient at 25 °C. For enclosed industrial designs at +70 °C ambient, ensure the enclosure conducts or convects heat away; the BGA exposed thermal pad must be soldered to a copper pour connected to the ground plane for adequate heat-spreading.
Do not power the SAMA5D27 without sequencing - VDDCORE (1.2 V) must rise before or simultaneously with VDDIO (3.3 V). Microchip's reference design uses a dedicated power-management IC (MIC2800 or similar) to enforce this sequence; bypassing it causes latch-up. Avoid using NAND boot on first prototypes - QSPI boot with an attached SPI flash is more forgiving and easier to recover from corrupted bootloaders. Finally, always populate 0 Ω resistors on JTAG test points for factory programming access.
Información de cumplimiento
RoHS and lead-free per Microchip product page. The -CU variant is not AEC-Q100 qualified - for automotive grades use -CNR. Halogen-free status not explicitly stated in verified web data.