ATSAMA5D27A-CU vs ATSAMA5D27A-CUR Comparación
Comparación detallada lado a lado de ATSAMA5D27A-CU por Microchip Technology y ATSAMA5D27A-CUR por Microchip Technology. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Microchip Technology
ATSAMA5D27A-CU - 500MHz Cortex-A5 MPU | Microchip | Embedded
ATSAMA5D27A-CU ✓ ActivoMicrochip Technology
ATSAMA5D27A-CUR - 500MHz ARM Cortex-A5 MPU | Microchip
ATSAMA5D27A-CUR ✓ ActivoComparación de especificaciones
| Parámetro | ATSAMA5D27A-CU | ATSAMA5D27A-CUR |
|---|---|---|
| Marca | Microchip Technology | Microchip Technology |
| Categoría | Microcontrollers | Microcontrollers |
| Estado del ciclo de vida | Activo | Activo |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $7,83 | $12,95 |
| Core Architecture | ARM Cortex-A5 (ARMv7-A) with NEON | — |
| Operating Frequency | 500 MHz | — |
| Core Count / Data Bus Width | 1 Core / 32-bit | — |
| Internal SRAM | 128 KB | — |
| External Memory Support | DDR2, DDR3L, LPDDR2, LPDDR3, QSPI, e.MMC, NAND | DDR2, DDR3L, LPDDR2, LPDDR3, QSPI, e.MMC |
| Encapsulado | 289-LFBGA (14x14 mm, 0.8 mm pitch) | 289-LFBGA (14x14 mm) |
| Tipo de montaje | Surface Mount | Surface Mount (BGA) |
| Tensión de alimentación | 3.3 V I/O, 1.2 V core (typ.) | — |
| Backup Mode Current | <5 µA | 5 uA (typ) |
| Temperatura de funcionamiento | -40 °C to +85 °C (industrial) | -40 C to +85 C (Industrial, MRLA marking) |
| Cryptography | AES, SHA, TRNG, secure boot | — |
| Display Interface | LCD controller, MIPI-DSI option | — |
| Touch Controller | Integrated Peripheral Touch Controller (PTC) | — |
| Communication Interfaces | CAN, HSIC, USB, EMAC, FLEXCOM x12 (UART/SPI/TWI) | — |
| Estado RoHS | Compliant | Compliant |
| Nivel MSL | 3 | 3 |
| Lead-Free | Yes | — |
| Series | — | SAMA5D2 |
| Core | — | ARM Cortex-A5 (1 core, 32-bit) |
| Maximum CPU Clock | — | 500 MHz |
| Maximum Junction Temperature | — | 105 C |
| Ball Pitch | — | 0.8 mm |
| Cache | — | 32 KB I-cache, 32 KB D-cache |
| FPU / NEON | — | Yes (VFPv4 + NEON) |
| AES-OTF (On-The-Fly) | — | Yes |
| CAN-FD Controllers | — | 2 |
| HSIC Interface | — | Yes |
| Peripheral Touch Controller | — | Yes (PTC) |
| Packaging | — | Tape & Reel (TR) |
| L1 Instruction Cache | — | 32 KB |
| L1 Data Cache | — | 32 KB |
| Embedded Audio Subsystem | — | Yes (I2S/TDM) |