ATSAME70N20A-CNT vs ATSAME70N20B-CNT Comparación
Comparación detallada lado a lado de ATSAME70N20A-CNT por Microchip Technology y ATSAME70N20B-CNT por Microchip Technology. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Microchip Technology
ATSAME70N20A-CNT - 300MHz Cortex-M7 MCU 1MB Flash | Microchip
ATSAME70N20A-CNT ✓ ActivoMicrochip Technology
ATSAME70N20B-CNT - 300MHz Cortex-M7 MCU, 1MB Flash, 100-TFBGA | Microchip
ATSAME70N20B-CNT ✓ ActivoComparación de especificaciones
| Parámetro | ATSAME70N20A-CNT | ATSAME70N20B-CNT |
|---|---|---|
| Marca | Microchip Technology | Microchip Technology |
| Categoría | Microcontrollers | Microcontrollers |
| Estado del ciclo de vida | Activo | Activo |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $8,85 | $10,50 |
| Core Architecture | ARM Cortex-M7 with FPU (single + double precision) | — |
| Frecuencia de reloj máxima | 300 MHz | — |
| Core Performance | 1500 CoreMark / 600 DMIPS | — |
| Flash Memory | 1024 KB (1 MB) | — |
| SRAM | 384 KB | — |
| Instruction Cache | 16 KB | — |
| Data Cache | 16 KB | — |
| Tightly-Coupled Memory (TCM) | Yes (ITCM + DTCM) | — |
| Operating Voltage | 1.62 V to 3.6 V (core 1.2 V internal) | — |
| Encapsulado | 100-pin TFBGA (9x9 mm) | 100-pin TFBGA (9x9 mm) |
| Temperatura de funcionamiento | -40 C to +105 C (industrial) | — |
| Tipo de montaje | Surface Mount (Tape & Reel, CNT suffix) | Surface Mount |
| Supply Voltage Range | 3.0 V to 3.6 V typical (VDDIO/VDDIN) | 1.08 V to 3.6 V |
| USB Interface | USB 2.0 High-Speed PHY integrated | — |
| Ethernet | 10/100 Mbps MAC (GMII/RMII/MII) | — |
| CAN Interface | CAN-FD x2 | — |
| ADC | 12-bit, up to 2 MSPS, 24 channels | [DATA_NEEDED: ADC resolution and channel count] |
| External Bus Interface (EBI) | 16-bit, supports SRAM/SDRAM/NOR up to 128 MB | — |
| Estado RoHS | Compliant | Compliant |
| Nivel MSL | 3 (168 hours) | 3 (per JEDEC J-STD-020) |
| Core | — | ARM Cortex-M7 with FPU |
| CPU Maximum Clock Frequency | — | 300 MHz |
| Program Memory Size | — | 1 MB (1024 Kbytes) Flash |
| RAM Size | — | 384 KB SRAM (multi-port) |
| Ancho del bus de datos | — | 32-bit |
| Rango de temperatura de funcionamiento | — | -40C to +85C (industrial) |
| Number of I/O Pins | — | [DATA_NEEDED: GPIO count] |
| Communication Interfaces | — | HS USB Host/Device, Ethernet (EMAC + IEEE 1588), 2x CAN-FD, SPI, TWI (I2C), UART/USART |
| Graphics Accelerator | — | Yes (integrated 2D GFX, supports TFT LCD up to 1024x768) |
| DMA Controllers | — | XDMAC + PDC peripheral DMA |
| MPU (Memory Protection) | — | Yes |
| Tightly-Coupled Memory | — | 16 KB TCM |