ATSAME70N20B-CNT vs ATSAME70N20B-ANT Comparación
Comparación detallada lado a lado de ATSAME70N20B-CNT por Microchip Technology y ATSAME70N20B-ANT por Microchip Technology. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Microchip Technology
ATSAME70N20B-CNT - 300MHz Cortex-M7 MCU, 1MB Flash, 100-TFBGA | Microchip
ATSAME70N20B-CNT ✓ ActivoMicrochip Technology
ATSAME70N20B-ANT - ARM Cortex-M7 MCU 300MHz 1MB Flash LQFP-100 | Microchip
ATSAME70N20B-ANT ✓ ActivoComparación de especificaciones
| Parámetro | ATSAME70N20B-CNT | ATSAME70N20B-ANT |
|---|---|---|
| Marca | Microchip Technology | Microchip Technology |
| Categoría | Microcontrollers | Microcontrollers |
| Estado del ciclo de vida | Activo | Activo |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $10,50 | $8,20 |
| Core | ARM Cortex-M7 with FPU | ARM Cortex-M7 with FPU |
| CPU Maximum Clock Frequency | 300 MHz | — |
| Program Memory Size | 1 MB (1024 Kbytes) Flash | — |
| RAM Size | 384 KB SRAM (multi-port) | — |
| Ancho del bus de datos | 32-bit | — |
| Supply Voltage Range | 1.08 V to 3.6 V | 1.7 V to 3.6 V |
| Rango de temperatura de funcionamiento | -40C to +85C (industrial) | — |
| Encapsulado | 100-pin TFBGA (9x9 mm) | 100-LQFP (14x14 mm) |
| Tipo de montaje | Surface Mount | Surface Mount |
| Number of I/O Pins | [DATA_NEEDED: GPIO count] | — |
| Communication Interfaces | HS USB Host/Device, Ethernet (EMAC + IEEE 1588), 2x CAN-FD, SPI, TWI (I2C), UART/USART | USB 2.0 High-Speed, 2x CAN-FD, Ethernet MAC, 3x SPI, 4x UART/USART, 2x I2C, HS SD card |
| Graphics Accelerator | Yes (integrated 2D GFX, supports TFT LCD up to 1024x768) | — |
| ADC | [DATA_NEEDED: ADC resolution and channel count] | 12-bit, up to 2 Msps |
| DMA Controllers | XDMAC + PDC peripheral DMA | — |
| MPU (Memory Protection) | Yes | — |
| Tightly-Coupled Memory | 16 KB TCM | — |
| Estado RoHS | Compliant | Compliant |
| Nivel MSL | 3 (per JEDEC J-STD-020) | 3 (per LQFP standard) |
| Core Revision | — | r1p1 (silicon revision B) |
| Maximum Clock Speed | — | 300 MHz |
| Program Memory | — | 1 MB Flash (1M x 8) |
| SRAM | — | 384 KB |
| GPIO Count | — | 75 |
| Temperatura de funcionamiento | — | -40C to +105C (industrial) |
| DMA Channels | — | 24 (XDMAC) |
| Supply Current (active) | — | [DATA_NEEDED: active current value] |
| AEC-Q100 | — | Not applicable (industrial-grade) |
| Lead-Free | — | Yes |