BSC190N15NS3GATMA1 vs IRFS52N15DTRLP Comparación

Comparación detallada lado a lado de BSC190N15NS3GATMA1 por Infineon y IRFS52N15DTRLP por Infineon. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.

Infineon
IRFS52N15DTRLP IRFS52N15DTRLP - 150V 51A N-Channel HEXFET MOSFET D2PAK

IRFS52N15DTRLP - 150V 51A N-Channel HEXFET MOSFET D2PAK

IRFS52N15DTRLP ✓ Activo

Comparación de especificaciones

Parámetro BSC190N15NS3GATMA1 IRFS52N15DTRLP
Marca Infineon Infineon
Categoría MOSFETs MOSFETs
Estado del ciclo de vida Activo Activo
Estado del stock In Stock In Stock
Precio unitario (USD) $0,98 $1,62
Technology OptiMOS 3 (N-Channel) HEXFET (Planar)
Drain-Source Voltage (VDS) 150 V —
Continuous Drain Current (ID) at Tc=25C 50 A —
Continuous Drain Current (ID) at Tc=100C [DATA_NEEDED: ID at Tc=100C] —
Pulsed Drain Current (IDM) [DATA_NEEDED: pulsed drain current] —
Gate-Source Voltage (VGS) max 20 V —
Gate Threshold Voltage (VGS(th)) 2.5 V to 3.5 V 2.0 V to 4.0 V (typical 3 V)
On-Resistance RDS(on) max at VGS=10V 19 mOhm —
On-Resistance RDS(on) typ at VGS=10V [DATA_NEEDED: RDS(on) typical at 10V] —
Total Gate Charge (Qg) [DATA_NEEDED: total gate charge] [DATA_NEEDED: total gate charge in nC]
Power Dissipation (PD) at Tc=25C 125 W —
Rango de temperatura de funcionamiento -55 C to +150 C -55 C to +175 C (junction)
Encapsulado PG-TDSON-8-1 (TDSON-8 EP) D2PAK (TO-263) surface mount
Tipo de montaje Surface Mount Surface Mount
Estado RoHS Compliant Compliant
Nivel MSL 1 1 (per JEDEC J-STD-020, typical for D2PAK)
FET Type — N-Channel MOSFET
Drain-to-Source Voltage (Vdss) — 150 V
Continuous Drain Current (Id) @ TC = 25 C — 51 A (Tc)
Continuous Drain Current (Id) @ TC = 100 C — 36 A (Tc, estimated)
Continuous Drain Current (Id) @ TA = 25 C — 60 A (Ta, datasheet)
On-Resistance Rds(on) max @ VGS = 10 V — 32 mOhm
Gate-to-Drain Charge (Qgd) — [DATA_NEEDED: Qgd in nC]
Input Capacitance (Ciss) — [DATA_NEEDED: Ciss in pF]
Power Dissipation (Pd) @ TC = 25 C — 230 W (Tc)
Power Dissipation (Pd) @ TA = 25 C — 3.8 W (Ta)
Thermal Resistance Junction-to-Case (RthJC) — [DATA_NEEDED: RthJC in C/W]
Thermal Resistance Junction-to-Ambient (RthJA) — [DATA_NEEDED: RthJA in C/W]
Recuento de pines — 3 (Gate, Drain, Source) + tab
Lead-Free Finish — Yes (matte tin)

Hojas de datos y recursos

Examinar todos los productos Crear BOM Solicitar cotización