BSC9131NLE7HHHB vs BSC9131NJN1HHHB557 Comparación
Comparación detallada lado a lado de BSC9131NLE7HHHB por NXP Semiconductors y BSC9131NJN1HHHB557 por NXP Semiconductors. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | BSC9131NLE7HHHB | BSC9131NJN1HHHB557 |
|---|---|---|
| Marca | NXP Semiconductors | NXP Semiconductors |
| Categoría | Microcontrollers | Microcontrollers |
| Estado del ciclo de vida | Fin de vida | Activo |
| Product Type | QorIQ Qonverge system-on-chip | — |
| General-Purpose Processor Core | 1 core | — |
| Processor Architecture | PowerPC e500 | — |
| Processor Word Size | 32 bit | — |
| e500 Core Frequency | 800 MHz | — |
| DSP Core | StarCore SC3850 | — |
| DSP Frequency | 800 MHz | — |
| Specialist Accelerator | MAPLE-B2F | — |
| External Memory Support | DDR3 | — |
| Security Feature | SEC | — |
| Encapsulado | 520-FCBGA, 21 x 21 mm | — |
| Package Type | Flip-chip ball grid array | 520-FCBGA |
| Number of Package Balls | 520 balls | — |
| Temperatura de funcionamiento | 0°C to 105°C | — |
| Target Application 1 | Small-cell base station | — |
| Target Application 2 | Enterprise VoIP | — |
| Target Application 3 | Smart-grid control | — |
| Target Application 4 | Military and defense | — |
| Target Application 5 | Industrial applications | — |
| Estado RoHS | [DATA_NEEDED: RoHS status] | Compliant |
| REACH Status | [DATA_NEEDED: REACH status] | — |
| AEC-Q100 Qualification | [DATA_NEEDED: AEC-Q100 qualification] | — |
| Processor Type | — | QorIQ Qonverge multicore baseband processor |
| Processor Category | — | Embedded MPU / communications processor |
| Maximum Processor Frequency | — | 800 MHz |
| Ball Count | — | 520 balls |
| Package Technology | — | Flip-chip ball grid array |
| Tipo de montaje | — | Surface Mount |
| Core Count | — | [DATA_NEEDED: core count] |
| Memory Interface | — | [DATA_NEEDED: memory interface type and configuration] |
| Network and Serial Interfaces | — | [DATA_NEEDED: network and serial interface list] |
| Input Supply Voltage | — | [DATA_NEEDED: input supply voltage range] |
| I/O Voltage | — | [DATA_NEEDED: I/O voltage range] |
| Rango de temperatura de funcionamiento | — | [DATA_NEEDED: operating temperature range] |
| Resistencia térmica | — | [DATA_NEEDED: thermal resistance] |
| Maximum Junction Temperature | — | [DATA_NEEDED: maximum junction temperature] |
| Physical Dimensions | — | [DATA_NEEDED: package dimensions] |
| Estado del ciclo de vida | — | Active; in-stock listing reported by LCSC |
| Manufacturer | — | NXP Semiconductors |