BSC9131NLE7HHHB vs BSC9131NJN1HHHB557 对比
详细并排对比 BSC9131NLE7HHHB 出自 NXP Semiconductors 和 BSC9131NJN1HHHB557 出自 NXP Semiconductors。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况，以确定最适合您设计需求的元器件。
规格对比
| 参数 | BSC9131NLE7HHHB | BSC9131NJN1HHHB557 |
|---|---|---|
| 品牌 | NXP Semiconductors | NXP Semiconductors |
| 分类 | Microcontrollers | Microcontrollers |
| 生命周期状态 | 停产 | 有效 |
| Product Type | QorIQ Qonverge system-on-chip | — |
| General-Purpose Processor Core | 1 core | — |
| Processor Architecture | PowerPC e500 | — |
| Processor Word Size | 32 bit | — |
| e500 Core Frequency | 800 MHz | — |
| DSP Core | StarCore SC3850 | — |
| DSP Frequency | 800 MHz | — |
| Specialist Accelerator | MAPLE-B2F | — |
| External Memory Support | DDR3 | — |
| Security Feature | SEC | — |
| 封装 | 520-FCBGA, 21 x 21 mm | — |
| Package Type | Flip-chip ball grid array | 520-FCBGA |
| Number of Package Balls | 520 balls | — |
| 工作温度 | 0°C to 105°C | — |
| Target Application 1 | Small-cell base station | — |
| Target Application 2 | Enterprise VoIP | — |
| Target Application 3 | Smart-grid control | — |
| Target Application 4 | Military and defense | — |
| Target Application 5 | Industrial applications | — |
| RoHS 状态 | [DATA_NEEDED: RoHS status] | Compliant |
| REACH Status | [DATA_NEEDED: REACH status] | — |
| AEC-Q100 Qualification | [DATA_NEEDED: AEC-Q100 qualification] | — |
| Processor Type | — | QorIQ Qonverge multicore baseband processor |
| Processor Category | — | Embedded MPU / communications processor |
| Maximum Processor Frequency | — | 800 MHz |
| Ball Count | — | 520 balls |
| Package Technology | — | Flip-chip ball grid array |
| 安装类型 | — | Surface Mount |
| Core Count | — | [DATA_NEEDED: core count] |
| Memory Interface | — | [DATA_NEEDED: memory interface type and configuration] |
| Network and Serial Interfaces | — | [DATA_NEEDED: network and serial interface list] |
| Input Supply Voltage | — | [DATA_NEEDED: input supply voltage range] |
| I/O Voltage | — | [DATA_NEEDED: I/O voltage range] |
| 工作温度范围 | — | [DATA_NEEDED: operating temperature range] |
| 热阻 | — | [DATA_NEEDED: thermal resistance] |
| Maximum Junction Temperature | — | [DATA_NEEDED: maximum junction temperature] |
| Physical Dimensions | — | [DATA_NEEDED: package dimensions] |
| 生命周期状态 | — | Active; in-stock listing reported by LCSC |
| Manufacturer | — | NXP Semiconductors |