EP1AGX35CF484C6N vs EP1AGX50CF484C3 Comparación
Comparación detallada lado a lado de EP1AGX35CF484C6N por Intel y EP1AGX50CF484C3 por Intel. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | EP1AGX35CF484C6N | EP1AGX50CF484C3 |
|---|---|---|
| Marca | Intel | Intel |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | NRND | NRND |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $118,00 | $218,00 |
| Family | Arria GX | Arria GX |
| Logic Elements (LE) | 33,520 | — |
| Embedded Memory | 1,348,416 bits | — |
| User I/O Pins | 230 | 232 |
| Encapsulado | 484-pin FC-FBGA (Flip-Chip BGA) | 484-ball FBGA (FineLine BGA) |
| Process Technology | 90 nm | 90 nm |
| Core Supply Voltage | 1.2 V | — |
| Speed Grade | C6 (commercial) | C3 (commercial, fastest) |
| Temperatura de funcionamiento | 0C to +85C (commercial) | 0C to +85C (commercial) |
| Transceivers | 4 channels, 600 Mbps to 3.125 Gbps | — |
| DSP Blocks | 18x18 multipliers | — |
| Memory Blocks | M9K and M-RAM | — |
| I/O Standards | LVDS, LVTTL, LVCMOS, SSTL, HSTL | — |
| Tipo de montaje | Surface Mount | — |
| Nivel MSL | [DATA_NEEDED: MSL level] | — |
| Logic Elements | — | 50,160 |
| Adaptive Logic Modules (ALMs) | — | [DATA_NEEDED: ALM count] |
| Total RAM Bits | — | 2,475,072 bits |
| M4K Memory Blocks | — | 4,506 |
| M-RAM Blocks | — | 252 |
| Embedded Multipliers (18x18) | — | [DATA_NEEDED: multiplier count] |
| Transceiver Channels | — | 12 (up to 3.125 Gbps) |
| Core Voltage | — | 1.2 V |
| Configuration Method | — | Passive serial, Fast passive parallel, JTAG |
| Estado RoHS | — | Compliant |