EP1AGX90EF1152I6 vs EP1AGX60EF1152I6N Comparación
Comparación detallada lado a lado de EP1AGX90EF1152I6 por Intel y EP1AGX60EF1152I6N por Intel. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Intel
EP1AGX60EF1152I6N - Arria GX 60 FPGA, 60K LE, 1152-BGA | Intel / Altera
EP1AGX60EF1152I6N ObsoleteComparación de especificaciones
| Parámetro | EP1AGX90EF1152I6 | EP1AGX60EF1152I6N |
|---|---|---|
| Marca | Intel | Intel |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | NRND | Obsolete |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $1.245,00 | $142,00 |
| Manufacturer | Intel (formerly Altera) | — |
| Series | Arria GX | Arria GX |
| Family | Arria GX FPGA | Arria GX FPGA |
| Process Technology | 90 nm | — |
| Logic Elements (LEs) | 90220 | — |
| Number of LABs/CLBs | 4511 | — |
| Total RAM Bits | 4477824 | 2,528,640 |
| User I/O Count | 538 | 514 |
| Number of Logic Elements/Cells | 90220 | — |
| Core Supply Voltage | 1.15 V to 1.25 V | — |
| Encapsulado / Carcasa | 1152-BBGA, FCBGA | — |
| Supplier Device Package | 1152-FBGA (35 x 35 mm) | — |
| Temperatura de funcionamiento | -40 C to +100 C (Industrial) | -40 °C to +100 °C (Industrial, suffix I) |
| Tipo de montaje | Surface Mount | Surface Mount (BGA) |
| Estado RoHS | [DATA_NEEDED: RoHS compliance status] | Compliant (per distributor listing) |
| Lead Free | [DATA_NEEDED: lead-free status] | — |
| Embedded Transceiver Channels | Up to 4 channels | — |
| Speed Grade | 6 | 6 |
| Configuration Mode | PS / FPP / JTAG | — |
| Número de pines | 1152 | — |
| Logic Elements (LE) | — | 60,100 |
| Embedded Memory | — | 2,528,640 bits (≈2.4 Mbit) |
| LABs / CLBs | — | 3,005 |
| Transceiver Channels | — | 12 (3.125 Gbps, embedded CDR/SERDES) |
| 18 × 18 Hardware Multipliers | — | 252 |
| PLLs | — | 4 (one per quadrant) plus transceiver PLLs |
| Encapsulado | — | 1152-BBGA (FBGA-1152, 35 × 35 mm, 1.0 mm pitch) |
| Process Node | — | 90 nm |
| Supply Voltage (Core) | — | [DATA_NEEDED: VCCINT/VCC typical value] |
| Hard IP | — | PCI Express ×1/×4, Gigabit Ethernet MAC, 8B/10B encoder/decoder |
| Memory Interfaces | — | DDR, DDR2, QDRII, RLDRAM (external memory controller) |
| Nivel MSL | — | 3 (per JEDEC J-STD-020) |