EP1AGX90EF1152I6 vs EP1AGX60EF1152I6N Comparaison
Comparaison détaillée côte à côte de EP1AGX90EF1152I6 par Intel et EP1AGX60EF1152I6N par Intel. Comparez les spécifications clés, les paramètres électriques, le conditionnement, le statut de cycle de vie, les prix et la disponibilité pour déterminer le meilleur composant pour vos exigences de conception.
Intel
EP1AGX60EF1152I6N - Arria GX 60 FPGA, 60K LE, 1152-BGA | Intel / Altera
EP1AGX60EF1152I6N ObsoleteComparaison des spécifications
| Paramètre | EP1AGX90EF1152I6 | EP1AGX60EF1152I6N |
|---|---|---|
| Marque | Intel | Intel |
| Catégorie | FPGA & CPLD | FPGA & CPLD |
| Statut du cycle de vie | NRND | Obsolete |
| Statut du stock | In Stock | In Stock |
| Prix unitaire (USD) | $1 245,00 | $142,00 |
| Manufacturer | Intel (formerly Altera) | — |
| Series | Arria GX | Arria GX |
| Family | Arria GX FPGA | Arria GX FPGA |
| Process Technology | 90 nm | — |
| Logic Elements (LEs) | 90220 | — |
| Number of LABs/CLBs | 4511 | — |
| Total RAM Bits | 4477824 | 2,528,640 |
| User I/O Count | 538 | 514 |
| Number of Logic Elements/Cells | 90220 | — |
| Core Supply Voltage | 1.15 V to 1.25 V | — |
| Boîtier / Format | 1152-BBGA, FCBGA | — |
| Supplier Device Package | 1152-FBGA (35 x 35 mm) | — |
| Température de fonctionnement | -40 C to +100 C (Industrial) | -40 °C to +100 °C (Industrial, suffix I) |
| Type de montage | Surface Mount | Surface Mount (BGA) |
| Statut RoHS | [DATA_NEEDED: RoHS compliance status] | Compliant (per distributor listing) |
| Lead Free | [DATA_NEEDED: lead-free status] | — |
| Embedded Transceiver Channels | Up to 4 channels | — |
| Speed Grade | 6 | 6 |
| Configuration Mode | PS / FPP / JTAG | — |
| Nombre de broches | 1152 | — |
| Logic Elements (LE) | — | 60,100 |
| Embedded Memory | — | 2,528,640 bits (≈2.4 Mbit) |
| LABs / CLBs | — | 3,005 |
| Transceiver Channels | — | 12 (3.125 Gbps, embedded CDR/SERDES) |
| 18 × 18 Hardware Multipliers | — | 252 |
| PLLs | — | 4 (one per quadrant) plus transceiver PLLs |
| Boîtier | — | 1152-BBGA (FBGA-1152, 35 × 35 mm, 1.0 mm pitch) |
| Process Node | — | 90 nm |
| Supply Voltage (Core) | — | [DATA_NEEDED: VCCINT/VCC typical value] |
| Hard IP | — | PCI Express ×1/×4, Gigabit Ethernet MAC, 8B/10B encoder/decoder |
| Memory Interfaces | — | DDR, DDR2, QDRII, RLDRAM (external memory controller) |
| Niveau MSL | — | 3 (per JEDEC J-STD-020) |