EP1C12F256C6N vs EP1C12F256C8 Comparación
Comparación detallada lado a lado de EP1C12F256C6N por Intel y EP1C12F256C8 por Intel. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Intel
EP1C12F256C6N - 12,060 LEs Cyclone FPGA 256-BGA | Intel / Altera
EP1C12F256C6N ⚠ Última compraComparación de especificaciones
| Parámetro | EP1C12F256C6N | EP1C12F256C8 |
|---|---|---|
| Marca | Intel | Intel |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Última compra | Activo |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $51,90 | $35,20 |
| Family | Cyclone® | Cyclone I |
| Logic Elements (LEs) | 12,060 | — |
| Logic Array Blocks (LABs) | 1,206 | — |
| Embedded Memory Bits | 239,616 bits | — |
| M4K RAM Blocks | 52 | — |
| Embedded 18x18 Multipliers | Yes | — |
| PLLs | 2 | — |
| Maximum User I/O | 185 | — |
| User I/O Banks | [DATA_NEEDED: number of user I/O banks] | — |
| Core Voltage (VCCINT) | 1.5 V | — |
| I/O Voltage (VCCIO) | 1.5 V / 1.8 V / 2.5 V / 3.3 V (bank-dependent) | — |
| Process Technology | 0.13 µm SRAM | 130 nm SRAM |
| Encapsulado | 256-ball FBGA (F256) | — |
| Temperatura de funcionamiento | 0 °C to +85 °C (commercial) | 0°C to +85°C (commercial grade) |
| Speed Grade | 6 | — |
| Configuration Method | Serial (EPCS) / JTAG | Passive Serial / Active Serial / JTAG |
| Estado RoHS | [DATA_NEEDED: RoHS status] | — |
| Tipo de montaje | Surface Mount (BGA) | Surface Mount |
| Series | — | Cyclone |
| Logic Elements (LE) | — | 12,060 |
| Total RAM Bits | — | 239,616 |
| Number of LABs/CLBs | — | 1,206 |
| Number of Logic Elements/Cells | — | 12,060 |
| Number of I/O | — | 185 |
| Number of PLLs | — | 2 |
| Total Memory Bits | — | 239,616 |
| Encapsulado / Carcasa | — | 256-BGA (FBGA) |
| Core Voltage | — | 1.5 V |
| I/O Voltage Range | — | 1.5 V to 3.3 V |
| Supplier Device Package | — | 256-FBGA (17x17 mm) |