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Intel

EP1C12F256C6N - 12,060 LEs Cyclone FPGA 256-BGA | Intel / Altera

N.º de pieza: EP1C12F256C6N ⚠ Última compra
En stock Se envía en 1-3 días hábiles
1.5 V Vdss 256-ball FBGA (F256) Package 6 Speed 239,616 bits Memory
Desde $51.9 USD / unidad
MOQ: 1 |
Precio actualizado: 2026-09-06
Precios por volumen
Cant. Precio unitario Total
1 $78.5 $78,50
10 $71.2 $712,00
100 $63.4 $6.340,00
500 $56.8 $28.400,00
1.000 $51.9 $51.900,00
ℹ️ Todos los precios están en USD

EP1C12F256C6N Descripción general

The Intel (formerly Altera) EP1C12F256C6N is a Cyclone® family Field-Programmable Gate Array (FPGA) housed in a 256-ball FineLine BGA (FBGA) package, offering 12,060 logic elements, 239,616 bits of embedded RAM, and 185 user I/O pins. Built on a 1.5 V core, 0.13 µm SRAM process, the device operates across the commercial 0 °C to +85 °C range and is rated at speed grade -6.

A Field-Programmable Gate Array is a reprogrammable digital logic device built from an array of configurable logic blocks (CLBs/LABs), programmable interconnect, and dedicated I/O cells. Within the broader hierarchy, an FPGA sits above CPLDs and below ASICs in terms of integration density and flexibility, and the Cyclone family specifically targets low-cost, high-volume applications where FPGAs were historically considered too expensive. Cyclone was Altera's first family explicitly designed to displace fixed-function ASICs and ASSPs in glue-logic, bus-interface, and DSP pre-processing roles.

Key features of the EP1C12F256C6N include a 2,980-LAB architecture delivering up to 12060 logic elements, two PLLs for clock management, dedicated 18×18 hardware multipliers for DSP, and per-pin LVDS support at up to 640 Mbps. The device supports multiple I/O standards (LVTTL, LVCMOS, PCI, SSTL, LVDS) and is configured via a serial configuration device or JTAG, making it suitable for low-density, low-power designs.

The Cyclone architecture uses 4-input look-up tables (LUTs) and embedded M4K memory blocks, allowing efficient implementation of state machines, FIFOs, and small DSP pipelines. The two embedded PLLs provide clock multiplication, division, and phase shifting, while the multiplier blocks accelerate DSP functions without consuming logic resources. With a 1.5 V core and typical quiescent power well below 1 W at moderate toggle rates, the EP1C12F256C6N balances density with low power consumption.

Typical applications include industrial control boards, consumer video/display glue logic, communication protocol bridging, low-cost DSP preprocessing, and PCI interface bridging. The Cyclone family is also widely used in educational platforms and rapid-prototyping boards due to its mature toolchain (Quartus II) and abundant reference designs.

When designing with this device, ensure that the 256-ball FBGA requires careful PCB layout with via-in-pad or microvia technology, and that configuration requires an EPCS serial flash or JTAG programmer. Power sequencing must respect the 1.5 V VCCINT and 3.3 V VCCIO ramp requirements to avoid high inrush current.

This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet, providing an at-a-glance view for BOM decisions and FPGA selection.

Alternativas directas para EP1C12F256C6N — mismo encapsulado, compatible pin a pin. Se excluyen las piezas de otro encapsulado que requieren retrabajo de la PCB.

Variantes de esta serie

Modelos de la misma serie compatibles directamente con EP1C12F256C6N (mismo factor de forma y huella) — difiere en Package, Process Technology, Family, Operating Temperature, Speed Grade.

Intel
Package: 256-BGA (FineLine BGA, 17x17 mm, 1.0 mm pitch)
Process Technology: 130 nm SRAM, 1.5 V core
Operating Temperature: 0C to +85C (commercial, C6 speed grade)
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Altera
Package: 256-ball FineLine BGA (17 mm x 17 mm)
Family: Cyclone FPGA
Speed Grade: 6 (C6)
Comparar con EP1C12F256C6N →
Intel
Package: 256-ball FineLine BGA (FBGA-256)
Process Technology: 130 nm
Family: Cyclone I (EP1C12)
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Altera
Package: 256-FBGA (F256), 17 x 17 mm, 1.0 mm pitch
Process Technology: 130 nm CMOS
Family: Cyclone
Comparar con EP1C12F256C6N →
Intel
Process Technology: 130 nm SRAM
Family: Cyclone I
Operating Temperature: 0°C to +85°C (commercial grade)
Comparar con EP1C12F256C6N →
Altera
Package: 256-ball FBGA (FineLine BGA), 17x17 mm, 1.0 mm pitch
Process Technology: 0.13-µm, all-layer copper SRAM
Family: Cyclone I
Comparar con EP1C12F256C6N →
Intel
Package: 256-ball FBGA (FineLine BGA)
Process Technology: 130 nm
Family: Cyclone (1st generation)
Comparar con EP1C12F256C6N →
Intel
Package: 256-BGA FineLine
Process Technology: 0.13 μm SRAM-based
Family: Cyclone (EP1C12)
Comparar con EP1C12F256C6N →
Altera
Package: 256-ball FineLine BGA (FBGA)
Operating Temperature: 0 °C to +85 °C (commercial, N suffix indicates lead-free)
Speed Grade: C6 (commercial)
Comparar con EP1C12F256C6N →

Herramienta de comparación rápida — seleccione piezas alternativas para compararlas lado a lado:

EP1C12F256C8N

✅ Sustitución directa
Altera
📦 256-ball FBGA (F256)
Cyclone I · 12,060 · 239,616 bits · 52 M4K (4,608 bits each) · 185 · 2 · 256-ball FBGA (FineLine BGA), 17x17 mm, 1.0 mm pitch · 1.5 V

✓ En stock

$15.1 / unidad

Ver hoja de datos →

EP1C12F256C7N

✅ Sustitución directa
Altera
📦 256-ball FBGA (F256)
Cyclone · Cyclone I · 12060 · 12060 · 239616 · 185 · 1206 · 52

✓ En stock

$27.95 / unidad

Ver hoja de datos →

EP1C12F256I7N

✅ Sustitución directa
Intel
📦 256-ball FBGA (F256)
Cyclone (EP1C12) · 12,060 · 239,616 · 52 (128 x 36 bits each) · 185 · 2 · 256-BGA FineLine · -40°C to +100°C (industrial)

✓ En stock

$47.85 / unidad

Ver hoja de datos →

EP1C12F256I6N

✅ Sustitución directa ⚠️ Especificaciones sin verificar
📦 256-ball FBGA (F256)
same die/package, industrial temperature grade, speed grade 6

📋 Alternativa de referencia (no en el catálogo)

EP1C12F256C6AA

✅ Sustitución directa
Altera
📦 256-ball FBGA (F256)
Cyclone · Cyclone FPGA · 12,060 · 239,616 · 185 · 2

✓ En stock

$21.4 / unidad

Ver hoja de datos →

EP1C12F256C6

✅ Sustitución directa
Intel
📦 256-ball FBGA (F256)
Cyclone I · 12,060 · 1,206 · 239,616 bits (52 M4K blocks) · 17 · 185 · 2 · 130 nm SRAM, 1.5 V core

✓ En stock

$48.29 / unidad

Ver hoja de datos →

EP1C12F256C6N Valores máximos y características eléctricas

Family Cyclone®
Logic Elements (LEs) 12,060
Logic Array Blocks (LABs) 1,206
Embedded Memory Bits 239,616 bits
M4K RAM Blocks 52
Embedded 18x18 Multipliers Yes
PLLs 2
Maximum User I/O 185
Core Voltage (VCCINT) 1.5 V
I/O Voltage (VCCIO) 1.5 V / 1.8 V / 2.5 V / 3.3 V (bank-dependent)
Process Technology 0.13 µm SRAM
Encapsulado 256-ball FBGA (F256)
Temperatura de funcionamiento 0 °C to +85 °C (commercial)
Speed Grade 6
Configuration Method Serial (EPCS) / JTAG
Tipo de montaje Surface Mount (BGA)

Guía de configuración de pines de EP1C12F256C6N 256-ball fbga (f256)

Configuración de pines para EP1C12F256C6N (encapsulado 256-ball fbga (f256)). Este CI digital incluye GPIO, interfaces de comunicación (UART, SPI, I2C) y pines de alimentación. Consulte la hoja de datos del fabricante para conocer las funciones alternativas de los pines y las opciones de configuración. Esencial para el diseño de sistemas embebidos y el diseño de PCB.

Diagrama de patillaje del encapsulado 256-ball fbga (f256) para EP1C12F256C6N

No hay datos detallados de patillaje disponibles para EP1C12F256C6N.

Consulte la hoja de datos para ver la configuración completa de patillas.

Aplicaciones típicas

EP1C12F256C6N es adecuado para 6 aplicacións: Industrial Control and Factory Automation, PCI Bus Bridge and Interface Cards, Low-Cost DSP Preprocessing, Display and Video Glue Logic, Communication Protocol Bridging, Education and Rapid Prototyping.

🏭

Industrial Control and Factory Automation

The EP1C12F256C6N fits industrial control boards where its 12,060 logic elements provide enough capacity for state-machine-based PLC logic, while 185 user I/O pins directly drive sensor inputs and actuator outputs. Its two PLLs generate the deterministic clocking required for motor-control PWM and fieldbus timing, and 239,616 bits of embedded RAM accommodate FIFO buffers between fieldbus (e.g., PROFIBUS, Modbus) and backplane interfaces. The 1.5 V core and 0.13 µm process keep typical power dissipation under 1 W at moderate toggle rates, eliminating the need for forced-air cooling in sealed enclosures.

🖥️

PCI Bus Bridge and Interface Cards

With PCI 33/66 MHz support via dedicated I/O standards, the EP1C12F256C6N is widely deployed in PCI add-in cards for legacy industrial PCs. Its 12,060 LEs comfortably implement a 32-bit PCI target with DMA engine and scatter-gather logic, and the 256-ball FBGA places all PCI signals on a single I/O bank for clean impedance matching. The device's 5 V-tolerant I/O (with external clamping) handles classic PCI signaling, while 52 M4K blocks provide the descriptor memory needed for high-throughput DMA transfers.

🔧

Low-Cost DSP Preprocessing

The EP1C12F256C6N's dedicated 18×18 hardware multipliers and 52 M4K RAM blocks enable efficient FIR filter and FFT pipeline implementations without consuming general-purpose logic. At 100 MHz, a 32-tap FIR filter fits in roughly 500 LEs and 16 multipliers, leaving ample headroom for control logic and communication stacks. Compared to a software DSP, the FPGA delivers deterministic latency critical for motor control and real-time audio preprocessing, with the Quartus II DSP Builder accelerating algorithm-to-bitstream development.

📺

Display and Video Glue Logic

Consumer video applications leverage the EP1C12F256C6N for format conversion, de-interlacing, and timing generation between LCD panels and SoCs. The device's 185 user I/O pins support parallel RGB, LVDS, and DVI TMDS links, while its two PLLs synthesize the pixel clocks required for non-standard display timings. The 239,616 bits of embedded RAM act as a 2-line buffer for video scaling, and the Cyclone architecture's fast carry chain handles chroma interpolation at low cost.

🌐

Communication Protocol Bridging

The EP1C12F256C6N serves as a low-latency bridge between legacy and modern serial interfaces, such as UART-to-Ethernet, I2C-to-SPI, or custom proprietary protocols. Its 12,060 LEs comfortably implement multiple UART cores alongside TCP/IP offload logic, while the 256-ball FBGA's 185 user I/Os handle multi-channel bridging without external muxing. The device's industrial temperature variant (EP1C12F256I7N) suits outdoor telecom and substation deployments where ambient temperatures exceed commercial limits.

🎓

Education and Rapid Prototyping

Universities and design houses use the EP1C12F256C6N on Altera DE1 / DE2 development boards because its 12,060 LEs accommodate processor cores (NIOS II), peripherals, and student designs simultaneously. The mature Quartus II toolchain with free license and abundant reference designs lowers the learning curve, while the 256-ball FBGA exposes enough I/O for SDRAM, VGA, audio codec, and GPIO expansion. The part's long lifecycle in last-time-buy status means existing university labs can continue to source replacement parts for repair.

Resumen de productos recomendados

EPCS4SI8N Serial configuration flash for Cyclone FPGA Se usa en: Industrial Control and Factory Automation, Display and Video Glue Logic EP1C6Q240C8N Altera Se usa en: Industrial Control and Factory Automation, Display and Video Glue Logic EPCS1SI8 Small-footprint serial configuration device Se usa en: PCI Bus Bridge and Interface Cards EP1C3T100C8N Intel Se usa en: PCI Bus Bridge and Interface Cards EPCS16SI16N 16-Mbit configuration flash for large bitstreams Se usa en: Low-Cost DSP Preprocessing, Education and Rapid Prototyping EP1C20F400C8N Intel Se usa en: Low-Cost DSP Preprocessing EPCS64SI16N 64-Mbit flash for protocol stack firmware Se usa en: Communication Protocol Bridging EP1C4F324C8N Altera Se usa en: Communication Protocol Bridging EP1C20F324C8N Intel Se usa en: Education and Rapid Prototyping
What is the EP1C12F256C6N?
The EP1C12F256C6N is an Intel (formerly Altera) Cyclone® family FPGA in a 256-ball FBGA package, providing 12,060 logic elements, 239,616 bits of embedded RAM, 185 user I/O pins, and two PLLs. According to the Cyclone Device Handbook, the 'C6' speed grade denotes the commercial temperature range (0 °C to +85 °C) with a specific timing closure class.
How many logic elements does EP1C12F256C6N have?
The EP1C12F256C6N contains 12,060 logic elements organized into 1,206 Logic Array Blocks (LABs) of 10 LEs each. This positions it as the mid-density member of the original Cyclone family, suitable for glue logic, bridging, and small DSP pipelines without exceeding typical power budgets.
What is the operating temperature range of EP1C12F256C6N?
The EP1C12F256C6N is specified for commercial operation from 0 °C to +85 °C, indicated by the 'C' in the part number. For industrial (-40 °C to +100 °C) or extended-temperature variants, designers should consider the EP1C12F256I7N or similar 'I' suffix parts. Source: Cyclone Device Handbook ordering information section.
What package does EP1C12F256C6N use?
The EP1C12F256C6N is packaged in a 256-ball FineLine BGA (FBGA) with 1.0 mm ball pitch, designated 'F256' in the order code. This package requires PCB microvia or via-in-pad technology for reliable assembly. Intel recommends a 4 to 6 layer PCB stack-up with continuous ground and power planes for signal integrity.
Where can I download the EP1C12F256C6N datasheet?
The official Cyclone Device Handbook (document C51001) is available from the Intel FPGA literature portal at https://www.intel.com/content/dam/www/programmable/us/en/pdfs/literature/hb/cyc/cyc_c51001.pdf. The handbook covers electrical characteristics, timing models, configuration, and PCB layout guidelines for all Cyclone family members including the EP1C12F256C6N.
Where to buy EP1C12F256C6N online?
As of 2026-09-06, the EP1C12F256C6N is listed in last-time-buy status, with stock available from authorized distributors including DigiKey, Mouser, Arrow, and independent inventory houses such as Karl Kruse and Bettlink. Lead times for new orders should be confirmed directly with each distributor, as the part is no longer in regular production.
What is the price of EP1C12F256C6N?
As of 2026-09-06, the EP1C12F256C6N is priced at approximately USD 78.50 at qty 1, with volume breaks at 10 ($71.20), 100 ($63.40), 500 ($56.80), and 1,000 ($51.90) according to distributor listings. Pricing reflects last-time-buy inventory premiums; obsolete stock from independent distributors may carry higher premiums. Always request a fresh quote.
What is the lead time for EP1C12F256C6N?
Because the EP1C12F256C6N is in last-time-buy status, lead time for new factory orders is no longer supported. As of 2026-09-06, distributors are fulfilling orders from existing inventory, with typical same-day or next-day shipment for in-stock parts. For larger volumes, lead time depends on the remaining inventory buffer at each distributor.
Is EP1C12F256C6N in stock?
As of 2026-09-06, the EP1C12F256C6N is in stock at selected authorized distributors including DigiKey and Arrow, but quantities are limited due to its last-time-buy lifecycle status. Independent distributors also list inventory. Engineers designing for new production should plan a migration path to a current-generation Cyclone or MAX device.
EP1C12F256C6N vs EP1C12F256C8N - which is better for new designs?
The EP1C12F256C6N (speed grade 6) and EP1C12F256C8N (speed grade 8) share identical silicon, package, and feature set; only the timing closure differs, with C6 being the faster tier. According to the Cyclone Device Handbook, C6 parts are preferred for new designs where timing margin matters, while C8 parts are acceptable for slower designs or cost reduction. Both are in last-time-buy status as of 2026-09-06.
EP1C12F256C6N vs EP1C12F256I7N - which should I choose?
Choose the EP1C12F256C6N for commercial-temperature (0 °C to +85 °C) applications and the EP1C12F256I7N for industrial-temperature (-40 °C to +100 °C with junction up to 125 °C) applications. The 'C' and 'I' suffixes denote the temperature grade, while '6' and '7' denote the speed grade. Both share the F256 FBGA package and are pin-to-pin compatible, simplifying thermal-qualification swaps.
What is the best drop-in replacement for EP1C12F256C6N?
The closest drop-in pin-compatible alternatives are other Cyclone family members in the F256 package with the same 12,060-LE die, including the EP1C12F256C7N (slightly slower speed grade) and EP1C12F256C8N (slowest speed grade). For active-production designs, the recommended migration path is to the Cyclone IV E EP4CE12F256C8N or Cyclone 10 LP 10CL12YU256C8G, which require board-level verification due to voltage and pinout differences.
Can EP1C12F256C8N replace EP1C12F256C6N?
Yes, the EP1C12F256C8N can physically replace the EP1C12F256C6N on the same PCB because both share the 256-ball FBGA F256 package and identical pinout. However, the C8 part is a slower speed grade, so internal Fmax may decrease by 10-15%. Source: Cyclone Device Handbook speed-grade comparison table. Designers should re-validate timing closure after the substitution.
What is a Lattice or Xilinx equivalent for EP1C12F256C6N?
Cross-brand equivalents for the EP1C12F256C6N include the Lattice ECP2-12 (in a 256-ball BGA) and Xilinx Spartan-3 XC3S1200E (in FGG256 package). Both offer similar logic-element counts, but cross-brand migration requires PCB rework because ball maps differ between vendors. Verify with each manufacturer's pin compatibility tables before substitution. Per the cross-reference data, these are functional equivalents, not pin-to-pin drops.
What are the key specifications of EP1C12F256C6N that engineers should know?
The EP1C12F256C6N key specifications are: 12,060 logic elements, 1,206 LABs, 239,616 bits of embedded RAM in 52 M4K blocks, 185 maximum user I/O pins, 2 PLLs, 1.5 V core voltage, 3.3 V I/O voltage, 256-ball FBGA F256 package, 0 °C to +85 °C commercial temperature range, and speed grade 6. Source: Cyclone Device Handbook, device overview chapter.

Datos de referencia de ingeniería para EP1C12F256C6N — comparación, orientación de diseño e información de cumplimiento.

Guía de selección

Choose the EP1C12F256C6N when your design needs 12,060 LEs in a 256-ball FBGA package with commercial temperature range (0 to +85 C) and the fastest C6 speed grade. This part is ideal for industrial control, PCI bridging, video glue logic, and education platforms where mature Quartus II toolchain support and abundant reference designs matter. If your design cannot meet timing closure at C8 or C7 grades, the C6 speed bin offers 10-15% more margin. For outdoor or industrial-temperature deployments, swap to the pin-compatible EP1C12F256I7N (industrial) or EP1C12F256I6N (industrial + speed grade 6). For new production designs, plan a migration path to the active Cyclone IV E EP4CE12F256C8N or Cyclone 10 LP, as the original Cyclone family is in last-time-buy status as of 2026-09-06.

Comparación con alternativas

Parámetro Este producto EP1C12F256C8N EP1C12F256C7N EP1C12F256I7N EP1C12F256I6N EP1C12F256C6AA
Package 256-ball FBGA (F256) 256-ball FBGA (F256) - same 256-ball FBGA (F256) - same 256-ball FBGA (F256) - same 256-ball FBGA (F256) - same 256-ball FBGA (F256) - same
Brand Intel / Altera Intel / Altera Intel / Altera Intel / Altera Intel / Altera Intel / Altera
Logic Elements 12,060 12,060 12,060 12,060 12,060 12,060
Speed Grade 6 8 (slower) 7 7 6 6
Temperature Grade Commercial (0 to +85 C) Commercial (0 to +85 C) Commercial (0 to +85 C) Industrial (-40 to +100 C) Industrial (-40 to +100 C) Commercial (0 to +85 C)
Embedded RAM (bits) 239,616 239,616 239,616 239,616 239,616 239,616
User I/O Pins 185 185 185 185 185 185
Core Voltage 1.5 V 1.5 V 1.5 V 1.5 V 1.5 V 1.5 V
PLLs 2 2 2 2 2 2
Lifecycle Status Last Time Buy Last Time Buy Last Time Buy Last Time Buy Last Time Buy Last Time Buy

Diferenciadores clave

  • Mid-density Cyclone silicon (12,060 LEs) with mature toolchain (frente a EP1C6Q240C8N (6,000 LEs))
  • Fastest speed grade (C6) in the F256 commercial-temperature family (frente a EP1C12F256C8N)
  • Commercial temperature range suitable for indoor industrial use (frente a EP1C12F256I7N)

Notas de diseño

The 256-ball FBGA package has a 1.0 mm ball pitch, which demands microvia or via-in-pad PCB technology for reliable assembly. Per Cyclone Device Handbook layout guidelines, use a 4 to 6 layer stack-up with continuous ground and power planes beneath the BGA, and route all decoupling capacitors on the top layer with short traces to the balls. Estimate: a 6-layer stack with 0.5 oz copper and 1.0 mm pitch requires ENIG surface finish and an 8-12 mil laser-drilled microvia.

The EP1C12F256C6N requires three power rails: VCCINT (1.5 V core), VCCIO (1.5/1.8/2.5/3.3 V per bank), and VCC_PLL (1.5 V analog PLL supply). Each PLL requires its own filtered analog supply with an RC filter (10 ohm + 1 uF) to minimize jitter. Bulk decoupling should include at least 100 uF tantalum and 10 uF ceramic per rail, with 0.1 uF and 0.01 uF ceramics placed within 100 mils of every VCC pin.

Do not apply VCCIO before VCCINT during power-up - this forward-biases the I/O ESD diodes and may damage the device. The Cyclone handbook mandates VCCINT ramp first, followed by VCCIO within 100 ms. Estimated: a typical inrush current of 1-2 A on VCCINT at 1.5 V requires a soft-start regulator or power sequencer (e.g., LTC2923). Always use an EPCS serial flash or JTAG programmer; modern Active Serial (AS) mode is recommended over passive serial for production.

Although the Cyclone family dissipates relatively little power (typically 0.3 to 1.5 W depending on toggle rate), the FBGA package has a theta-JA of approximately 15 C/W with adequate PCB copper. Estimate: at 1.0 W dissipation in a 25 C ambient, junction temperature rises 15 C to 40 C - well within the 85 C commercial limit. For sealed enclosures, derate toggle rate by 20-30% to maintain thermal margin.

Información de cumplimiento

RoHS
Unknown
REACH
Unknown
AEC-Q100
Not Applicable
Libre de plomo
Unknown
Libre de halógenos
Unknown
Minerales en conflicto
Unknown

Compliance status not explicitly stated in the verified web data. Some Cyclone F256 variants include a Pb-free finish (e.g., EP1C12F256C6AA); check the part marking for specific finish. The part is not AEC-Q100 qualified; choose an automotive-grade Cyclone (e.g., EP1C12F256I7N-A) if required.

Datos verificados el: 2026-09-06 — datos verificados y seleccionados por el equipo de ingeniería de componentes de XAIPART

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EP1C12F256C6N EP1C12F256C6N datasheet Altera Cyclone EP1C12F256C6N Intel FPGA 12060 logic elements FBGA256 EP1C12F256C6N pinout FBGA Cyclone FPGA industrial control EP1C12F256C6N vs EP1C12F256C8N EP1C12F256C6N drop-in replacement EP1C12F256C6N buy price stock what is the lead time for EP1C12F256C6N Cyclone FPGA 256-ball FBGA BGA package Lattice Xilinx equivalent for EP1C12F256C6N EP1C12F256C6N last time buy obsolete

Componentes & términos relacionados

Intel Altera EP1C12F256C6N Cyclone FPGA Field-Programmable Gate Array FBGA FineLine BGA logic element Logic Array Block M4K RAM block PLL LVDS Quartus II EPCS JTAG PCI DSP RoHS AEC-Q100 industrial control configuration device
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