EP1C12F256C7 vs EP1C12F256C6N Comparación
Comparación detallada lado a lado de EP1C12F256C7 por Intel y EP1C12F256C6N por Intel. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Intel
EP1C12F256C6N - 12,060 LEs Cyclone FPGA 256-BGA | Intel / Altera
EP1C12F256C6N ⚠ Última compraComparación de especificaciones
| Parámetro | EP1C12F256C7 | EP1C12F256C6N |
|---|---|---|
| Marca | Intel | Intel |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Obsolete | Última compra |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $46,30 | $51,90 |
| Series | Cyclone | — |
| Family | Cyclone I (EP1C12) | Cyclone® |
| Logic Elements (LEs) | 12,060 | 12,060 |
| Logic Array Blocks (LABs) | 1,206 | 1,206 |
| Total RAM Bits | 239,616 | — |
| Embedded Multipliers (18x18) | 52 | — |
| User I/O Pins | 185 | — |
| Number of I/O Banks | 4 | — |
| PLLs | 2 | 2 |
| Process Technology | 130 nm | 0.13 µm SRAM |
| Core Voltage (VCCINT) | 1.5 V | 1.5 V |
| I/O Voltage (VCCIO) | 1.5 V to 3.3 V (bank-dependent) | 1.5 V / 1.8 V / 2.5 V / 3.3 V (bank-dependent) |
| Encapsulado | 256-ball FineLine BGA (FBGA-256) | 256-ball FBGA (F256) |
| Tipo de montaje | Surface Mount | Surface Mount (BGA) |
| Temperatura de funcionamiento | 0C to +85C (Commercial, 'C' suffix) | 0 °C to +85 °C (commercial) |
| Speed Grade | 7 | 6 |
| Configuration Mode | PS / AS / JTAG | — |
| Estado RoHS | [DATA_NEEDED: confirm from product page] | [DATA_NEEDED: RoHS status] |
| Lead-Free / Halogen-Free | [DATA_NEEDED: confirm] | — |
| Nivel MSL | [DATA_NEEDED: confirm] | — |
| Embedded Memory Bits | — | 239,616 bits |
| M4K RAM Blocks | — | 52 |
| Embedded 18x18 Multipliers | — | Yes |
| Maximum User I/O | — | 185 |
| User I/O Banks | — | [DATA_NEEDED: number of user I/O banks] |
| Configuration Method | — | Serial (EPCS) / JTAG |