EP1C12F256C8 vs EP1C12F256C7 Comparación
Comparación detallada lado a lado de EP1C12F256C8 por Intel y EP1C12F256C7 por Intel. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | EP1C12F256C8 | EP1C12F256C7 |
|---|---|---|
| Marca | Intel | Intel |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Activo | Obsolete |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $35,20 | $46,30 |
| Series | Cyclone | Cyclone |
| Family | Cyclone I | Cyclone I (EP1C12) |
| Logic Elements (LE) | 12,060 | — |
| Total RAM Bits | 239,616 | 239,616 |
| Number of LABs/CLBs | 1,206 | — |
| Number of Logic Elements/Cells | 12,060 | — |
| Number of I/O | 185 | — |
| Number of PLLs | 2 | — |
| Total Memory Bits | 239,616 | — |
| Encapsulado / Carcasa | 256-BGA (FBGA) | — |
| Tipo de montaje | Surface Mount | Surface Mount |
| Temperatura de funcionamiento | 0°C to +85°C (commercial grade) | 0C to +85C (Commercial, 'C' suffix) |
| Core Voltage | 1.5 V | — |
| I/O Voltage Range | 1.5 V to 3.3 V | — |
| Supplier Device Package | 256-FBGA (17x17 mm) | — |
| Process Technology | 130 nm SRAM | 130 nm |
| Configuration Method | Passive Serial / Active Serial / JTAG | — |
| Logic Elements (LEs) | — | 12,060 |
| Logic Array Blocks (LABs) | — | 1,206 |
| Embedded Multipliers (18x18) | — | 52 |
| User I/O Pins | — | 185 |
| Number of I/O Banks | — | 4 |
| PLLs | — | 2 |
| Core Voltage (VCCINT) | — | 1.5 V |
| I/O Voltage (VCCIO) | — | 1.5 V to 3.3 V (bank-dependent) |
| Encapsulado | — | 256-ball FineLine BGA (FBGA-256) |
| Speed Grade | — | 7 |
| Configuration Mode | — | PS / AS / JTAG |
| Estado RoHS | — | [DATA_NEEDED: confirm from product page] |
| Lead-Free / Halogen-Free | — | [DATA_NEEDED: confirm] |
| Nivel MSL | — | [DATA_NEEDED: confirm] |