EP1C12F256C8 vs EP1C12F256C7 Vergleich
Detaillierter Direktvergleich von EP1C12F256C8 von Intel und EP1C12F256C7 von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | EP1C12F256C8 | EP1C12F256C7 |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Aktiv | Obsolete |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $35,20 | $46,30 |
| Series | Cyclone | Cyclone |
| Family | Cyclone I | Cyclone I (EP1C12) |
| Logic Elements (LE) | 12,060 | — |
| Total RAM Bits | 239,616 | 239,616 |
| Number of LABs/CLBs | 1,206 | — |
| Number of Logic Elements/Cells | 12,060 | — |
| Number of I/O | 185 | — |
| Number of PLLs | 2 | — |
| Total Memory Bits | 239,616 | — |
| Gehäuse / Bauform | 256-BGA (FBGA) | — |
| Montageart | Surface Mount | Surface Mount |
| Betriebstemperatur | 0°C to +85°C (commercial grade) | 0C to +85C (Commercial, 'C' suffix) |
| Core Voltage | 1.5 V | — |
| I/O Voltage Range | 1.5 V to 3.3 V | — |
| Supplier Device Package | 256-FBGA (17x17 mm) | — |
| Process Technology | 130 nm SRAM | 130 nm |
| Configuration Method | Passive Serial / Active Serial / JTAG | — |
| Logic Elements (LEs) | — | 12,060 |
| Logic Array Blocks (LABs) | — | 1,206 |
| Embedded Multipliers (18x18) | — | 52 |
| User I/O Pins | — | 185 |
| Number of I/O Banks | — | 4 |
| PLLs | — | 2 |
| Core Voltage (VCCINT) | — | 1.5 V |
| I/O Voltage (VCCIO) | — | 1.5 V to 3.3 V (bank-dependent) |
| Gehäuse | — | 256-ball FineLine BGA (FBGA-256) |
| Speed Grade | — | 7 |
| Configuration Mode | — | PS / AS / JTAG |
| RoHS-Status | — | [DATA_NEEDED: confirm from product page] |
| Lead-Free / Halogen-Free | — | [DATA_NEEDED: confirm] |
| MSL-Level | — | [DATA_NEEDED: confirm] |