EP1C12F324C7N vs EP1C12F324C8L Comparación
Comparación detallada lado a lado de EP1C12F324C7N por Intel y EP1C12F324C8L por Intel. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | EP1C12F324C7N | EP1C12F324C8L |
|---|---|---|
| Marca | Intel | Intel |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Obsolete | NRND |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $37,20 | $23,40 |
| Series | Cyclone | — |
| Family | Cyclone I | Cyclone |
| Manufacturer | Intel (formerly Altera) | — |
| Logic Elements (LEs) | 12,060 | — |
| Logic Array Blocks (LABs) | 1,206 | — |
| Embedded Memory (bits) | 239,616 | — |
| Maximum User I/O | 249 | — |
| Number of PLLs | 2 | — |
| Process Technology | 130 nm CMOS | CMOS, 130 nm |
| Core Voltage | 1.5 V | — |
| Tensión de alimentación de funcionamiento | 1.5 V to 3.3 V | — |
| Maximum Internal Frequency | 320 MHz | — |
| Speed Grade | C7 (commercial, -40C to 85C; spec datasheet: 0C to 85C) | 8 |
| Encapsulado / Carcasa | 324-BGA (FBGA-324, 19 x 19 mm, 1.0 mm pitch) | — |
| Tipo de montaje | Surface Mount | Surface Mount (BGA) |
| Configuration Method | AS / PS / JTAG | — |
| Estado RoHS | Compliant (N suffix = lead-free) | Compliant |
| Temperatura de funcionamiento | [DATA_NEEDED: precise commercial temperature range per datasheet] | 0C to +85C (commercial) |
| Logic Elements | — | 12,060 |
| Embedded RAM Bits | — | 239,616 |
| M4K RAM Blocks | — | 52 |
| User I/O Pins | — | 249 |
| PLLs | — | 2 |
| Encapsulado | — | FBGA-324 |
| Package Body Size | — | 19 x 19 mm |
| Ball Pitch | — | 1.0 mm |
| Core Voltage (VCCINT) | — | 1.5 V |
| I/O Voltage (VCCIO) | — | 1.5 V / 1.8 V / 2.5 V / 3.3 V |
| Power Variant | — | Low-power (L suffix) |
| Nivel MSL | — | [DATA_NEEDED: MSL level] |