EP1C4F324I7 vs EP1C4F324C7 Comparación
Comparación detallada lado a lado de EP1C4F324I7 por Intel y EP1C4F324C7 por Intel. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | EP1C4F324I7 | EP1C4F324C7 |
|---|---|---|
| Marca | Intel | Intel |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Activo | Obsolete |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $27,80 | $46,80 |
| Series | Cyclone | Cyclone |
| Family | Cyclone I | — |
| Logic Elements | 4,000 | 4 000 |
| Logic Array Blocks (LABs) | 400 | — |
| Total RAM Bits | 78,336 | — |
| Embedded 18x18 Multipliers | 17 | — |
| User I/O Pins | 249 | — |
| PLLs | 2 | — |
| Process Technology | 130 nm | CMOS, 130 nm-class (Cyclone generation) |
| Core Supply Voltage | 1.5 V | 1.5 V |
| I/O Supply Voltage | 3.3 V | — |
| Internal Clock Frequency (max) | 405 MHz | — |
| Temperatura de funcionamiento | -40C to +85C (Industrial) | Commercial (0 °C to +85 °C) inferred from speed grade C7 |
| Encapsulado | 324-FBGA (FineLine BGA), 19x19 mm, 1.0 mm pitch | 324-FBGA, 19 × 19 mm, 1.0 mm pitch, lead-free |
| Tipo de montaje | Surface Mount | Surface Mount (BGA) |
| Configuration Mode | AS / PS / JTAG | — |
| Estado RoHS | Lead Free (per datasheet marking) | Compliant (lead-free FBGA) |
| Device Type | — | FPGA (Field-Programmable Gate Array) |
| Logic Array Blocks / CLBs | — | 400 CLBs |
| Embedded Memory (Bits) | — | 78 336 |
| Maximum User I/O | — | 249 |
| Internal Frequency (max, family ref) | — | 405 MHz |
| Configuration Modes | — | Passive Serial (PS), Active Serial (AS), JTAG |
| Nivel MSL | — | 3 (per JEDEC J-STD-020, typical for BGA-324) |