EP1C4F400C8N vs EP1C4F324C8N Comparación
Comparación detallada lado a lado de EP1C4F400C8N por Intel y EP1C4F324C8N por Altera. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Intel
EP1C4F400C8N - 4K LE Cyclone FPGA 301 I/O 400-FBGA | Intel/Altera
EP1C4F400C8N ⚠ Última compra
Comparación de especificaciones
| Parámetro | EP1C4F400C8N | EP1C4F324C8N |
|---|---|---|
| Marca | Intel | Altera |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Última compra | NRND |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $15,26 | $14,20 |
| Family | Cyclone (Altera/Intel) | — |
| Logic Elements (LE) | 4,000 | — |
| Logic Array Blocks (LAB) | 400 | — |
| Total RAM Bits | 78,336 | 78336 |
| M4K RAM Blocks | 17 | — |
| Embedded Multipliers (18x18) | [DATA_NEEDED: 18x18 multiplier count] | — |
| PLLs | 2 | — |
| Maximum User I/O Pins | 301 | — |
| Global Clock Networks | 8 | — |
| Process Technology | 130 nm SRAM | — |
| Core Voltage | 1.5 V | — |
| Speed Grade | 8 (commercial) | C8 (speed grade 8) |
| Temperatura de funcionamiento | 0C to +85C (commercial) | — |
| Encapsulado | 400-ball FBGA (FineLine BGA) | — |
| Tipo de montaje | Surface Mount (BGA) | — |
| Configuration Mode | AS, PS, JTAG | — |
| Configuration Device | EPCS1/EPCS4/EPCS16 | — |
| External Memory Support | DDR SDRAM, DDR2, SDR up to 266 Mbps | — |
| Estado RoHS | Compliant (lead-free 'N' suffix) | Compliant (inferred from lead-free N finish) |
| Nivel MSL | 3 | — |
| JTAG Support | Yes (IEEE 1149.1 boundary scan) | — |
| Device Family | — | Cyclone |
| Programmable Logic Type | — | FPGA |
| Number of Logic Elements/Cells | — | 4000 |
| Number of LABs/CLBs | — | 400 |
| Number of User I/Os | — | 249 |
| Number of PLLs | — | [DATA_NEEDED: Number of PLLs] |
| Core Supply Voltage | — | 1.5 V |
| Maximum Internal Frequency (datasheet listing) | — | 405 MHz |
| Encapsulado / Carcasa | — | 324-ball FBGA (19 mm x 19 mm, 1.0 mm pitch) |
| Number of Terminals | — | 324 |
| Estilo de montaje | — | Surface Mount |
| Rango de temperatura de funcionamiento | — | 0°C to +85°C (commercial grade) |
| Solder Finish | — | Lead-free (N suffix) |
| Configuration | — | SRAM-based, external configuration |