EP1C4F400C8N vs EP1C4F324C8N Comparaison
Comparaison détaillée côte à côte de EP1C4F400C8N par Intel et EP1C4F324C8N par Altera. Comparez les spécifications clés, les paramètres électriques, le conditionnement, le statut de cycle de vie, les prix et la disponibilité pour déterminer le meilleur composant pour vos exigences de conception.
Intel
EP1C4F400C8N - 4K LE Cyclone FPGA 301 I/O 400-FBGA | Intel/Altera
EP1C4F400C8N ⚠ Dernier achat
Comparaison des spécifications
| Paramètre | EP1C4F400C8N | EP1C4F324C8N |
|---|---|---|
| Marque | Intel | Altera |
| Catégorie | FPGA & CPLD | FPGA & CPLD |
| Statut du cycle de vie | Dernier achat | NRND |
| Statut du stock | In Stock | In Stock |
| Prix unitaire (USD) | $15,26 | $14,20 |
| Family | Cyclone (Altera/Intel) | — |
| Logic Elements (LE) | 4,000 | — |
| Logic Array Blocks (LAB) | 400 | — |
| Total RAM Bits | 78,336 | 78336 |
| M4K RAM Blocks | 17 | — |
| Embedded Multipliers (18x18) | [DATA_NEEDED: 18x18 multiplier count] | — |
| PLLs | 2 | — |
| Maximum User I/O Pins | 301 | — |
| Global Clock Networks | 8 | — |
| Process Technology | 130 nm SRAM | — |
| Core Voltage | 1.5 V | — |
| Speed Grade | 8 (commercial) | C8 (speed grade 8) |
| Température de fonctionnement | 0C to +85C (commercial) | — |
| Boîtier | 400-ball FBGA (FineLine BGA) | — |
| Type de montage | Surface Mount (BGA) | — |
| Configuration Mode | AS, PS, JTAG | — |
| Configuration Device | EPCS1/EPCS4/EPCS16 | — |
| External Memory Support | DDR SDRAM, DDR2, SDR up to 266 Mbps | — |
| Statut RoHS | Compliant (lead-free 'N' suffix) | Compliant (inferred from lead-free N finish) |
| Niveau MSL | 3 | — |
| JTAG Support | Yes (IEEE 1149.1 boundary scan) | — |
| Device Family | — | Cyclone |
| Programmable Logic Type | — | FPGA |
| Number of Logic Elements/Cells | — | 4000 |
| Number of LABs/CLBs | — | 400 |
| Number of User I/Os | — | 249 |
| Number of PLLs | — | [DATA_NEEDED: Number of PLLs] |
| Core Supply Voltage | — | 1.5 V |
| Maximum Internal Frequency (datasheet listing) | — | 405 MHz |
| Boîtier / Format | — | 324-ball FBGA (19 mm x 19 mm, 1.0 mm pitch) |
| Number of Terminals | — | 324 |
| Style de montage | — | Surface Mount |
| Plage de température de fonctionnement | — | 0°C to +85°C (commercial grade) |
| Solder Finish | — | Lead-free (N suffix) |
| Configuration | — | SRAM-based, external configuration |