EP1C6T144C8N vs EP1C6T144I6ES Comparación
Comparación detallada lado a lado de EP1C6T144C8N por Intel y EP1C6T144I6ES por Intel. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | EP1C6T144C8N | EP1C6T144I6ES |
|---|---|---|
| Marca | Intel | Intel |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Activo | Obsolete |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $12,95 | $17,95 |
| Series | Cyclone® | — |
| Family | Cyclone I | Cyclone |
| Logic Elements (LE) | 5,980 | — |
| Logic Array Blocks (LAB) | 598 | — |
| Total RAM Bits | 92,160 | 92,160 (approx 92 Kbits) |
| User I/O Pins | 98 | — |
| Number of I/O Banks | 4 | — |
| PLLs | 2 | 2 |
| Maximum Internal Frequency | 275 MHz | 405 MHz |
| Speed Grade | C8 (commercial) | I6 (industrial, slowest grade) |
| Core Voltage (VCCINT) | 1.425 V to 1.575 V (typ. 1.5 V) | — |
| Process Technology | 0.13 µm all-layer copper SRAM | — |
| Encapsulado | 144-pin TQFP | TQFP-144 (22 x 22 mm, 0.5 mm pitch, gull-wing, lead-free) |
| Tipo de montaje | Surface Mount | Surface Mount |
| Temperatura de funcionamiento | 0°C to +85°C (commercial) | — |
| Configuration Method | Active Serial (EPCS), Passive Serial, JTAG | — |
| Nivel MSL | 3 (per JEDEC J-STD-020) | [DATA_NEEDED: MSL rating not in Verified Web Data] |
| Estado RoHS | Compliant | — |
| Logic Elements (LEs) | — | 5,980 |
| Logic Array Blocks (LABs) | — | 598 (10 LEs per LAB) |
| Embedded Multipliers | — | 0 (not supported in this generation) |
| Maximum User I/O Pins | — | [DATA_NEEDED: max user I/O for TQFP-144 variant] |
| Package Code (JEDEC) | — | LFQFP |
| Maximum Seated Height | — | 1.6 mm |
| Core Voltage | — | 1.5 V (typ) |
| Rango de temperatura de funcionamiento | — | -40C to +100C (industrial, 'I' suffix) |
| Configuration Interface | — | JTAG, Passive Serial (PS), EPC configuration devices |
| Process Node | — | 0.13 um SRAM |
| Lead-Free / RoHS | — | Yes (lead-free, RoHS compliant per Verified Web Data) |
| Supported I/O Standards | — | LVTTL, LVCMOS, LVDS, SSTL-2, SSTL-3 |