EP1C6T144C8N vs EP1C6T144I6ES Comparaison
Comparaison détaillée côte à côte de EP1C6T144C8N par Intel et EP1C6T144I6ES par Intel. Comparez les spécifications clés, les paramètres électriques, le conditionnement, le statut de cycle de vie, les prix et la disponibilité pour déterminer le meilleur composant pour vos exigences de conception.
Comparaison des spécifications
| Paramètre | EP1C6T144C8N | EP1C6T144I6ES |
|---|---|---|
| Marque | Intel | Intel |
| Catégorie | FPGA & CPLD | FPGA & CPLD |
| Statut du cycle de vie | Actif | Obsolete |
| Statut du stock | In Stock | In Stock |
| Prix unitaire (USD) | $12,95 | $17,95 |
| Series | Cyclone® | — |
| Family | Cyclone I | Cyclone |
| Logic Elements (LE) | 5,980 | — |
| Logic Array Blocks (LAB) | 598 | — |
| Total RAM Bits | 92,160 | 92,160 (approx 92 Kbits) |
| User I/O Pins | 98 | — |
| Number of I/O Banks | 4 | — |
| PLLs | 2 | 2 |
| Maximum Internal Frequency | 275 MHz | 405 MHz |
| Speed Grade | C8 (commercial) | I6 (industrial, slowest grade) |
| Core Voltage (VCCINT) | 1.425 V to 1.575 V (typ. 1.5 V) | — |
| Process Technology | 0.13 µm all-layer copper SRAM | — |
| Boîtier | 144-pin TQFP | TQFP-144 (22 x 22 mm, 0.5 mm pitch, gull-wing, lead-free) |
| Type de montage | Surface Mount | Surface Mount |
| Température de fonctionnement | 0°C to +85°C (commercial) | — |
| Configuration Method | Active Serial (EPCS), Passive Serial, JTAG | — |
| Niveau MSL | 3 (per JEDEC J-STD-020) | [DATA_NEEDED: MSL rating not in Verified Web Data] |
| Statut RoHS | Compliant | — |
| Logic Elements (LEs) | — | 5,980 |
| Logic Array Blocks (LABs) | — | 598 (10 LEs per LAB) |
| Embedded Multipliers | — | 0 (not supported in this generation) |
| Maximum User I/O Pins | — | [DATA_NEEDED: max user I/O for TQFP-144 variant] |
| Package Code (JEDEC) | — | LFQFP |
| Maximum Seated Height | — | 1.6 mm |
| Core Voltage | — | 1.5 V (typ) |
| Plage de température de fonctionnement | — | -40C to +100C (industrial, 'I' suffix) |
| Configuration Interface | — | JTAG, Passive Serial (PS), EPC configuration devices |
| Process Node | — | 0.13 um SRAM |
| Lead-Free / RoHS | — | Yes (lead-free, RoHS compliant per Verified Web Data) |
| Supported I/O Standards | — | LVTTL, LVCMOS, LVDS, SSTL-2, SSTL-3 |