EP1K30FC256-1 vs EP1K30FC256-3AA Comparación
Comparación detallada lado a lado de EP1K30FC256-1 por Intel y EP1K30FC256-3AA por Altera. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | EP1K30FC256-1 | EP1K30FC256-3AA |
|---|---|---|
| Marca | Intel | Altera |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | NRND | Activo |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $17,85 | $17,95 |
| Family | ACEX-1K | ACEX-1K |
| Logic Elements | 17,280 | 1,728 |
| Typical Gates | 30,000 | 30,000 |
| Logic Cells | 1,728 | — |
| Embedded RAM Bits | 24,576 | — |
| User I/O Pins | 171 | — |
| Logic Array Blocks (LABs) | 216 | 216 |
| Embedded Array Blocks (EABs) | 6 | — |
| Core Voltage (VCCINT) | 2.5 V | — |
| I/O Voltage (VCCIO) | 3.3 V / 2.5 V (multi-voltage) | — |
| Operating Temperature Grade | Commercial (0C to +70C) | — |
| Speed Grade | -1 (standard, slowest in family) | -3 (fastest) |
| Maximum Internal Frequency | 250 MHz (per family datasheet) | — |
| Process Technology | 2.5 V CMOS | CMOS, SRAM-based |
| Encapsulado | 256-pin FineLine BGA (FBGA) | 256-FBGA (FineLine Ball Grid Array) |
| Tipo de montaje | Surface Mount (BGA) | Surface Mount |
| Configuration Interface | Passive Serial / Passive Parallel / JTAG | — |
| Programming Method | SRAM-based, in-system programmable | — |
| Estado RoHS | Compliant | [DATA_NEEDED: RoHS status] |
| Embedded Memory (EAB RAM) | — | 24,576 bits |
| Maximum User I/O | — | 171 |
| Core Voltage | — | 2.5 V |
| I/O Voltage | — | 3.3 V / 2.5 V / 1.8 V (bank-dependent) |
| Temperatura de funcionamiento | — | [DATA_NEEDED: operating temperature range] |
| Programming Interface | — | IEEE 1149.1 JTAG |
| LEs per LAB | — | 8 (typical for ACEX-1K) |