EP1K30FC256-1 vs EP1K30FC256-3AA Comparaison
Comparaison détaillée côte à côte de EP1K30FC256-1 par Intel et EP1K30FC256-3AA par Altera. Comparez les spécifications clés, les paramètres électriques, le conditionnement, le statut de cycle de vie, les prix et la disponibilité pour déterminer le meilleur composant pour vos exigences de conception.
Comparaison des spécifications
| Paramètre | EP1K30FC256-1 | EP1K30FC256-3AA |
|---|---|---|
| Marque | Intel | Altera |
| Catégorie | FPGA & CPLD | FPGA & CPLD |
| Statut du cycle de vie | NRND | Actif |
| Statut du stock | In Stock | In Stock |
| Prix unitaire (USD) | $17,85 | $17,95 |
| Family | ACEX-1K | ACEX-1K |
| Logic Elements | 17,280 | 1,728 |
| Typical Gates | 30,000 | 30,000 |
| Logic Cells | 1,728 | — |
| Embedded RAM Bits | 24,576 | — |
| User I/O Pins | 171 | — |
| Logic Array Blocks (LABs) | 216 | 216 |
| Embedded Array Blocks (EABs) | 6 | — |
| Core Voltage (VCCINT) | 2.5 V | — |
| I/O Voltage (VCCIO) | 3.3 V / 2.5 V (multi-voltage) | — |
| Operating Temperature Grade | Commercial (0C to +70C) | — |
| Speed Grade | -1 (standard, slowest in family) | -3 (fastest) |
| Maximum Internal Frequency | 250 MHz (per family datasheet) | — |
| Process Technology | 2.5 V CMOS | CMOS, SRAM-based |
| Boîtier | 256-pin FineLine BGA (FBGA) | 256-FBGA (FineLine Ball Grid Array) |
| Type de montage | Surface Mount (BGA) | Surface Mount |
| Configuration Interface | Passive Serial / Passive Parallel / JTAG | — |
| Programming Method | SRAM-based, in-system programmable | — |
| Statut RoHS | Compliant | [DATA_NEEDED: RoHS status] |
| Embedded Memory (EAB RAM) | — | 24,576 bits |
| Maximum User I/O | — | 171 |
| Core Voltage | — | 2.5 V |
| I/O Voltage | — | 3.3 V / 2.5 V / 1.8 V (bank-dependent) |
| Température de fonctionnement | — | [DATA_NEEDED: operating temperature range] |
| Programming Interface | — | IEEE 1149.1 JTAG |
| LEs per LAB | — | 8 (typical for ACEX-1K) |