EP1K30TI144-2N vs EP1K30TI144-2 Comparación
Comparación detallada lado a lado de EP1K30TI144-2N por Intel y EP1K30TI144-2 por Intel. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | EP1K30TI144-2N | EP1K30TI144-2 |
|---|---|---|
| Marca | Intel | Intel |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Obsolete | Obsolete |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $25,00 | $13,85 |
| Series | ACEX-1K | EP1K30 |
| Manufacturer | Intel (formerly Altera) | — |
| Logic Elements / Cells | 1728 | 1728 |
| Typical Gate Count | 30,000 gates | — |
| Embedded Memory (RAM bits) | 24,576 bits | — |
| Maximum User I/O | 102 | — |
| Number of Logic Array Blocks (LABs) | [DATA_NEEDED: LAB count] | 216 |
| Number of Embedded Array Blocks (EABs) | [DATA_NEEDED: EAB count] | — |
| Core Voltage (VCCINT) | 2.5 V | — |
| I/O Voltage (VCCIO) | 2.5 V / 3.3 V | — |
| Process Technology | 0.22 µm CMOS SRAM | 0.22 µm CMOS, SRAM-based |
| Speed Grade | -2 | -2 (mid-tier) |
| Operating Temperature Grade | Industrial | — |
| Rango de temperatura de funcionamiento | -40 °C to +100 °C ambient | — |
| Encapsulado | 144-pin LQFP | 144-LQFP (TQFP), 22 mm × 22 mm, 0.5 mm pitch |
| Lead Pitch | 0.5 mm | — |
| Tipo de montaje | Surface Mount | Surface Mount |
| Configuration Interface | JTAG (IEEE 1149.1), serial passive/active | — |
| Estado RoHS | Compliant (per Utmel product note) | [DATA_NEEDED: RoHS compliance - legacy part] |
| Nivel MSL | [DATA_NEEDED: MSL rating] | — |
| Family | — | ACEX-1K |
| Total RAM Bits | — | 24576 |
| Equivalent Gates | — | 30,000 |
| User I/O Count | — | 102 |
| Number of I/O Banks | — | 4 |
| Supply Voltage - Core | — | 2.5 V (2.375 V min, 2.625 V max) |
| Supply Voltage - I/O | — | 2.5 V / 3.3 V / 5.0 V (multiVolt) |
| Maximum Internal Frequency | — | 200 MHz |
| Embedded Memory Type | — | Dual-port EAB (Embedded Array Block) |
| Temperatura de funcionamiento | — | -40 °C to +85 °C (Industrial, "I" suffix) |
| Configuration Method | — | SRAM, requires external configuration PROM (EPC) |
| Programming Interface | — | JTAG (IEEE 1149.1) / IEEE 1532 ISP |