EP1K50FC256-1N vs EP1K50FC256-3 Comparación
Comparación detallada lado a lado de EP1K50FC256-1N por Intel y EP1K50FC256-3 por Intel. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | EP1K50FC256-1N | EP1K50FC256-3 |
|---|---|---|
| Marca | Intel | Intel |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Obsolete | Última compra |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $15,10 | $54,40 |
| Family | ACEX-1K | ACEX 1K |
| Series | ACEX-1K (2.5 V) | ACEX-1K |
| Maximum Logic Elements | 2,880 | — |
| Logic Array Blocks (LABs) | 360 | 360 |
| Typical Gates | 50,000 | 50,000 |
| Maximum System Gates | 199,000 | — |
| Embedded Memory (EAB) Bits | 40,960 bits | — |
| User I/O Pins | 186 | — |
| Core Supply Voltage | 2.5 V (2.375 V to 2.625 V) | — |
| Maximum Internal Frequency | 250 MHz | — |
| Process Technology | 0.22 um CMOS | 0.22 um CMOS |
| Typical Operating Current | 5 mA | — |
| Speed Grade | -1 (commercial) | -3 |
| Temperatura de funcionamiento | 0 C to 70 C (commercial) | Commercial (0C to +70C) [DATA_NEEDED: exact operating temp grade] |
| Encapsulado | 256-ball FBGA (FineLine BGA) | 256-pin FineLine BGA (FBGA-256) |
| Tipo de montaje | Surface Mount | Surface Mount |
| Lead Status | Lead-free (-N suffix) | — |
| Estado RoHS | Compliant | — |
| Programmable I/O Standards | LVTTL, LVCMOS, PCI, GTL+ | — |
| Configuration Method | SRAM-based, JTAG (IEEE 1149.1) | — |
| Logic Elements (LEs) | — | 2,880 |
| Embedded RAM Bits | — | 40,960 |
| Embedded Array Blocks (EABs) | — | 12 |
| Maximum User I/O | — | 186 |
| Core Voltage | — | 2.5 V |
| Maximum Frequency | — | 166.67 MHz |
| Package Dimensions | — | 17 x 17 mm |
| Programming Interface | — | JTAG (IEEE 1149.1), ByteBlaster |