EP1K50FC256-1N vs EP1K50FC256-3 Comparaison
Comparaison détaillée côte à côte de EP1K50FC256-1N par Intel et EP1K50FC256-3 par Intel. Comparez les spécifications clés, les paramètres électriques, le conditionnement, le statut de cycle de vie, les prix et la disponibilité pour déterminer le meilleur composant pour vos exigences de conception.
Comparaison des spécifications
| Paramètre | EP1K50FC256-1N | EP1K50FC256-3 |
|---|---|---|
| Marque | Intel | Intel |
| Catégorie | FPGA & CPLD | FPGA & CPLD |
| Statut du cycle de vie | Obsolete | Dernier achat |
| Statut du stock | In Stock | In Stock |
| Prix unitaire (USD) | $15,10 | $54,40 |
| Family | ACEX-1K | ACEX 1K |
| Series | ACEX-1K (2.5 V) | ACEX-1K |
| Maximum Logic Elements | 2,880 | — |
| Logic Array Blocks (LABs) | 360 | 360 |
| Typical Gates | 50,000 | 50,000 |
| Maximum System Gates | 199,000 | — |
| Embedded Memory (EAB) Bits | 40,960 bits | — |
| User I/O Pins | 186 | — |
| Core Supply Voltage | 2.5 V (2.375 V to 2.625 V) | — |
| Maximum Internal Frequency | 250 MHz | — |
| Process Technology | 0.22 um CMOS | 0.22 um CMOS |
| Typical Operating Current | 5 mA | — |
| Speed Grade | -1 (commercial) | -3 |
| Température de fonctionnement | 0 C to 70 C (commercial) | Commercial (0C to +70C) [DATA_NEEDED: exact operating temp grade] |
| Boîtier | 256-ball FBGA (FineLine BGA) | 256-pin FineLine BGA (FBGA-256) |
| Type de montage | Surface Mount | Surface Mount |
| Lead Status | Lead-free (-N suffix) | — |
| Statut RoHS | Compliant | — |
| Programmable I/O Standards | LVTTL, LVCMOS, PCI, GTL+ | — |
| Configuration Method | SRAM-based, JTAG (IEEE 1149.1) | — |
| Logic Elements (LEs) | — | 2,880 |
| Embedded RAM Bits | — | 40,960 |
| Embedded Array Blocks (EABs) | — | 12 |
| Maximum User I/O | — | 186 |
| Core Voltage | — | 2.5 V |
| Maximum Frequency | — | 166.67 MHz |
| Package Dimensions | — | 17 x 17 mm |
| Programming Interface | — | JTAG (IEEE 1149.1), ByteBlaster |