EP1K50FC256-2N vs EP1K50FC256-1N Comparación
Comparación detallada lado a lado de EP1K50FC256-2N por Intel y EP1K50FC256-1N por Intel. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | EP1K50FC256-2N | EP1K50FC256-1N |
|---|---|---|
| Marca | Intel | Intel |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Obsolete | Obsolete |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $17,95 | $15,10 |
| Family | ACEX-1K | ACEX-1K |
| Logic Elements (LEs) | 2,880 | — |
| Typical Gates | 50,000 | 50,000 |
| Embedded Memory (bits) | 40,960 | — |
| Embedded Array Blocks (EABs) | 10 | — |
| Logic Array Blocks (LABs) | 360 | 360 |
| Maximum User I/O Pins | 186 | — |
| Core Voltage (VCCINT) | 2.5 V (2.375 V to 2.625 V) | — |
| Temperatura de funcionamiento | 0 °C to 70 °C (Commercial) | 0 C to 70 C (commercial) |
| Process Technology | 0.22 µm CMOS SRAM | 0.22 um CMOS |
| Speed Grade | -2 | -1 (commercial) |
| Encapsulado | 256-ball FBGA (FineLine BGA) | 256-ball FBGA (FineLine BGA) |
| Package Dimensions | 16 x 16 mm | — |
| Configuration Method | JTAG / Passive Serial | SRAM-based, JTAG (IEEE 1149.1) |
| Estado RoHS | [DATA_NEEDED: RoHS status] | Compliant |
| Tipo de montaje | Surface Mount (BGA) | Surface Mount |
| Series | — | ACEX-1K (2.5 V) |
| Maximum Logic Elements | — | 2,880 |
| Maximum System Gates | — | 199,000 |
| Embedded Memory (EAB) Bits | — | 40,960 bits |
| User I/O Pins | — | 186 |
| Core Supply Voltage | — | 2.5 V (2.375 V to 2.625 V) |
| Maximum Internal Frequency | — | 250 MHz |
| Typical Operating Current | — | 5 mA |
| Lead Status | — | Lead-free (-N suffix) |
| Programmable I/O Standards | — | LVTTL, LVCMOS, PCI, GTL+ |