EP1K50FC256-2N vs EP1K50FC256-1N Comparison

Detailed side-by-side comparison of EP1K50FC256-2N by Intel and EP1K50FC256-1N by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

Specification Comparison

Parameter EP1K50FC256-2N EP1K50FC256-1N
Brand Intel Intel
Category FPGA & CPLD FPGA & CPLD
Lifecycle Status Obsolete Obsolete
Family ACEX-1K ACEX-1K
Logic Elements (LEs) 2,880 —
Typical Gates 50,000 50,000
Embedded Memory (bits) 40,960 —
Embedded Array Blocks (EABs) 10 —
Logic Array Blocks (LABs) 360 360
Maximum User I/O Pins 186 —
Core Voltage (VCCINT) 2.5 V (2.375 V to 2.625 V) —
Operating Temperature 0 °C to 70 °C (Commercial) 0 C to 70 C (commercial)
Process Technology 0.22 µm CMOS SRAM 0.22 um CMOS
Speed Grade -2 -1 (commercial)
Package 256-ball FBGA (FineLine BGA) 256-ball FBGA (FineLine BGA)
Package Dimensions 16 x 16 mm —
Configuration Method JTAG / Passive Serial SRAM-based, JTAG (IEEE 1149.1)
RoHS Status [DATA_NEEDED: RoHS status] Compliant
Mounting Type Surface Mount (BGA) Surface Mount
Series — ACEX-1K (2.5 V)
Maximum Logic Elements — 2,880
Maximum System Gates — 199,000
Embedded Memory (EAB) Bits — 40,960 bits
User I/O Pins — 186
Core Supply Voltage — 2.5 V (2.375 V to 2.625 V)
Maximum Internal Frequency — 250 MHz
Typical Operating Current — 5 mA
Lead Status — Lead-free (-N suffix)
Programmable I/O Standards — LVTTL, LVCMOS, PCI, GTL+

Datasheets & Resources

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